RF and Microwave Module Level Design and Integration /

This book is intended to bring together fundamental concepts and elements needed in the design, integration, and characterization phases of modern radio frequency (RF) and microwave modules and to familiarize the interested reader with the common challenges in this rapidly changing field. While desi...

Descripción completa

Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor principal: Almalkawi, Mohammad (Autor)
Formato: Electrónico eBook
Idioma:Inglés
Publicado: London : The Institution of Engineering and Technology, 2019.
Colección:Materials, circuits and devices series ; 34.
Temas:
Computer-aided design.
Electric circuits.
Electric networks, Passive.
Electronic circuit design.
Electronic packaging.
Impedance matching.
Lumped elements (Electronics)
Microwave circuits.
Conception assistée par ordinateur.
Circuits électriques.
Réseaux passifs (Télécommunications)
Circuits électroniques > Calcul.
Mise sous boîtier (Électronique)
Adaptation d'impédance.
Constantes localisées (Électronique)
Circuits pour micro-ondes.
computer-aided designs (visual works)
circuits.
computer-aided design (process)
Computer-aided design
Electric circuits
Electric networks, Passive
Electronic circuit design
Electronic packaging
Impedance matching
Microwave circuits
circuit CAD.
electromagnetic coupling.
electronics packaging.
impedance matching.
lumped parameter networks.
microwave circuits.
modules.
passive networks.
RF front-end modules
module-level measurements
component-level measurements
RF circuits
CAD
microwave circuits
electromagnetic field couplings
impedance matching networks
microwave network analysis
distributed passive elements
lumped passive elements
microwave device
RF device
device packaging
module packaging
Acceso en línea:Texto completo

Internet

Texto completo

Items no disponibles

Detalle de Existencias desde

Ejemplares similares