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Harsh environment electronics : interconnect materials and performance assessment /

Provides in-depth knowledge on novel materials that make electronics work under high-temperature and high-pressure conditions This book reviews the state of the art in research and development of lead-free interconnect materials for electronic packaging technology. It identifies the technical barrie...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Otros Autores: Sharif, Ahmed (Editor )
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Weinheim, Germany : Wiley-VCH Verlag GmbH & Co., [2019]
Temas:
Acceso en línea:Texto completo