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Hermeticity testing of MEMS and microelectronic packages /
Packaging of microelectronics has been developing since the invention of the transistor in 1947. With the increasing complexity and decreasing size of the die, packaging requirements have continued to change. A step change in package requirements came with the introduction of the Micro-Electro-Mecha...
| Clasificación: | Libro Electrónico |
|---|---|
| Autores principales: | , |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Boston :
Artech House,
[2013]
|
| Colección: | Artech House integrated microsystems series.
|
| Temas: | |
| Acceso en línea: | Texto completo |
MARC
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| 082 | 0 | 4 | |a 621.381/046 |2 23 |
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| 100 | 1 | |a Costello, Suzanne, |e author. | |
| 245 | 1 | 0 | |a Hermeticity testing of MEMS and microelectronic packages / |c Suzanne Costello, Marc P.Y. Desmulliez. |
| 264 | 1 | |a Boston : |b Artech House, |c [2013] | |
| 264 | 4 | |c Ã2013 | |
| 300 | |a 1 online resource (195 pages .) | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a computer |b c |2 rdamedia | ||
| 338 | |a online resource |b cr |2 rdacarrier | ||
| 347 | |a data file | ||
| 490 | 1 | |a Integrated microsystems series | |
| 504 | |a Includes bibliographical references and index. | ||
| 588 | 0 | |a Print version record. | |
| 505 | 0 | |a Preface; References; Part 1 Introduction to Hermetic Package; 1 The Evolution of Packages, Their Sealing Methods, and Modes of Fabrication ; 1.1 Introduction; 1.2 The Evolution of Microelectronics and MEMS Packages; 1.3 MEMS Sealing Techniques and Mode Package Fabrication; 1.3.1 Materials; 1.3.2 Sealing Techniques; 1.4 Summary of MEMS Packaging Materials and Techniques; References; 2 Assembly, Packaging, and Environmentally Induced Failures in MEMS; 2.1 Introduction; 2.2 Particle Contamination ; 2.3 Thermomechanical Constraints; 2.3.1 Thermomechanical Constraints in Di. | |
| 505 | 8 | |a 2.3.2 Thermomechanical Constraints in Pa2.3.3 Thermomechanical Constraints in Wa; 2.3.4 Thermomechanical Constraints in Fl; 2.4 Moisture and Gas Absorption; 2.4.1 Moisture Absorption; 2.4.2 Barrier Coatings: A Protection Aga; 2.4.3 Outgassing; 2.5 Conclusions: Reliability Demonstration and Accelerated Testing; References; 3 Packaging Requirements for Hermeticity; 3.1 The Need for Hermeticity in MEMS and; 3.2 Balancing Maximum Permissive Leak Ra; References; 4 The Different Types of Leaks in MEMS and Microelectronics Packaging; 4.1 Introduction; 4.2 Leak Channels or Capillary Leaks. | |
| 505 | 8 | |a 4.3 Permeation4.4 Outgassing; 4.5 Conclusion; References; Part 2 Traditional Hermeticity Test Techniques and Standards; 5 Ex Situ Hermeticity Test Methods; 5.1 Introduction; 5.2 Fine Leak Tests; 5.2.1 Helium Fine Leak Test; 5.2.2 Radioisotope Leak Detection Method; 5.3 Gross Leak Tests; 5.3.1 Fluorocarbon Liquid and Vapor Gross Leak Detection; 5.3.2 Gross Bubble Test; 5.3.3 Weight Gain; 5.3.4 Dye Penetrant Gross Leak Test; 5.4 Combinational Tests; 5.4.1 Optical Fine/Gross Leak Detection ; 5.4.2 Cumulative Helium Leak Detection (CHLD) Method; References. | |
| 505 | 8 | |a 6 The History of Hermeticity Standards MIL-STD-883 T.M. 1014 and MIL-STD-750 T.M. 10716.1 Introduction: The First Hermeticity Tests; 6.2 The Introduction of the Military Standards; 6.3 The First Problems with Traditional Hermeticity Tests and Standards; 6.4 Military Standard Revisions; 6.5 Summary; References; Part 3 Limitations of Existing Hermeticity Test Methods in Low Volume Packages; 7 Permeation; 7.1 Introduction; 7.2 Mathematics of Permeation; 7.3 Limitations of the Packaging Material; 7.4 Conclusions; References; 8 Outgassing and Residual Gas Analysis (RGA); 8.1 Outgassing. | |
| 505 | 8 | |a 8.2 Residual Gas AnalysisReferences; 9 Low-Cavity Volume Capillary Leak Limitatations; 9.1 Limitations of the Helium Fine Leak Test Method; 9.1.1 Volume Limitations; 9.1.2 Minimum Detectable Leak Rate; References; Part 4 Novel Methods of Leak Detection; 10 Q-Factor Monitoring of Resonant Microstructures as a Hermeticity Measurement Method; 10.1 Introduction; 10.2 Lumped Element Modeling of a Microresonator; 10.3 Definitions and Measurement Methods of the Quality Factor Q; 10.3.1 Definition in Terms of Stored Energy; 10.3.2 Definition in Terms of Bandwidth. | |
| 520 | |a Packaging of microelectronics has been developing since the invention of the transistor in 1947. With the increasing complexity and decreasing size of the die, packaging requirements have continued to change. A step change in package requirements came with the introduction of the Micro-Electro-Mechanical System (MEMS) whereby interactions with the external environment are, in some cases, required. This resource is a rapid, definitive reference on hermetic packaging for the MEMS and microelectronics industry, giving practical guidance on traditional and newly developed test methods. This book in. | ||
| 546 | |a English. | ||
| 590 | |a Knovel |b ACADEMIC - Electronics & Semiconductors | ||
| 650 | 0 | |a Microelectronic packaging |x Testing. | |
| 650 | 0 | |a Microelectromechanical systems |x Testing. | |
| 650 | 0 | |a Hermetic sealing |x Testing. | |
| 650 | 0 | |a Microelectronics |x Testing. | |
| 650 | 7 | |a Microelectronics |x Testing |2 fast | |
| 700 | 1 | |a Desmulliez, Marc P. Y., |d 1963- |e author. | |
| 776 | 0 | 8 | |i Print version: |a Costello, Suzanne. |t Hermeticity testing of MEMS and microelectronic packages. |d Boston : Artech House, [2013] |z 9781608075270 |z 1608075273 |
| 830 | 0 | |a Artech House integrated microsystems series. | |
| 856 | 4 | 0 | |u https://appknovel.uam.elogim.com/kn/resources/kpHTMEMSM3/toc |z Texto completo |
| 936 | |a BATCHLOAD | ||
| 938 | |a Internet Archive |b INAR |n hermeticitytesti0000cost | ||
| 938 | |a EBL - Ebook Library |b EBLB |n EBL1790784 | ||
| 938 | |a IEEE |b IEEE |n 9100920 | ||
| 938 | |a YBP Library Services |b YANK |n 12085518 | ||
| 994 | |a 92 |b IZTAP | ||