Hermeticity testing of MEMS and microelectronic packages /
Packaging of microelectronics has been developing since the invention of the transistor in 1947. With the increasing complexity and decreasing size of the die, packaging requirements have continued to change. A step change in package requirements came with the introduction of the Micro-Electro-Mecha...
Clasificación: | Libro Electrónico |
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Autores principales: | , |
Formato: | Electrónico eBook |
Idioma: | Inglés |
Publicado: |
Boston :
Artech House,
[2013]
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Colección: | Artech House integrated microsystems series.
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Temas: | |
Acceso en línea: | Texto completo |