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Hermeticity testing of MEMS and microelectronic packages /

Packaging of microelectronics has been developing since the invention of the transistor in 1947. With the increasing complexity and decreasing size of the die, packaging requirements have continued to change. A step change in package requirements came with the introduction of the Micro-Electro-Mecha...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autores principales: Costello, Suzanne (Autor), Desmulliez, Marc P. Y., 1963- (Autor)
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Boston : Artech House, [2013]
Colección:Artech House integrated microsystems series.
Temas:
Acceso en línea:Texto completo