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Introduction to semiconductor manufacturing technology /
Integrated circuit fabrication is a complex process, and engineers must have a deep understanding of the intricate technologies involved in order to be successful. This book, intended for technical and college students, provides an overview of key concepts, equipment, and techniques used in fabs tod...
| Clasificación: | Libro Electrónico |
|---|---|
| Autor principal: | |
| Autor Corporativo: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Bellingham, Wash. (1000 20th St. Bellingham WA 98225-6705 USA) :
SPIE Press,
[2012]
|
| Edición: | Second edition. |
| Colección: | SPIE monograph ;
PM220. |
| Temas: | |
| Acceso en línea: | Texto completo |
MARC
| LEADER | 00000cam a2200000 i 4500 | ||
|---|---|---|---|
| 001 | KNOVEL_ocn801513077 | ||
| 003 | OCoLC | ||
| 005 | 20231027140348.0 | ||
| 006 | m eo d | ||
| 007 | cr bn||||m|||a | ||
| 008 | 120719s2012 waua fob 000 0 eng d | ||
| 040 | |a SPIES |b eng |e rda |e pn |c SPIES |d OCLCQ |d OCLCO |d OCLCQ |d OCLCA |d OCLCQ |d KNOVL |d OCLCF |d DEBSZ |d ZCU |d OCLCQ |d OCLCO |d N$T |d KNOVL |d YDXCP |d OCLCQ |d STF |d OCLCQ |d FTU |d MERER |d OCLCQ |d BUF |d RRP |d OCLCA |d AU@ |d OCLCQ |d ORZ |d EYM |d OCLCO |d OCLCQ |d E7B |d COO |d VT2 |d KIJ |d CEF |d U3W |d WYU |d LVT |d UWW |d BWN |d SFB |d EBLCP |d MERUC |d HS0 |d OCLCQ |d VI# |d OCLCO | ||
| 019 | |a 830029110 |a 854970277 |a 868957930 |a 913039600 |a 961846162 |a 988616441 |a 999583668 |a 1065922697 |a 1086974359 |a 1124350583 |a 1127178228 |a 1136410292 | ||
| 020 | |a 9780819490933 |q (electronic bk.) | ||
| 020 | |a 0819490938 |q (electronic bk.) | ||
| 020 | |a 9781628701043 |q (electronic bk.) | ||
| 020 | |a 1628701048 |q (electronic bk.) | ||
| 020 | |z 9780819490926 |q (print) | ||
| 020 | |z 081949092X | ||
| 024 | 7 | |a 10.1117/3.924283 |2 doi | |
| 029 | 1 | |a AU@ |b 000050298518 | |
| 029 | 1 | |a AU@ |b 000051597646 | |
| 029 | 1 | |a DEBSZ |b 401639088 | |
| 029 | 1 | |a GBVCP |b 1018190570 | |
| 029 | 1 | |a GBVCP |b 814932886 | |
| 029 | 1 | |a NZ1 |b 14795699 | |
| 029 | 1 | |a NZ1 |b 15497693 | |
| 029 | 1 | |a NZ1 |b 15565981 | |
| 029 | 1 | |a DEBSZ |b 431330573 | |
| 035 | |a (OCoLC)801513077 |z (OCoLC)830029110 |z (OCoLC)854970277 |z (OCoLC)868957930 |z (OCoLC)913039600 |z (OCoLC)961846162 |z (OCoLC)988616441 |z (OCoLC)999583668 |z (OCoLC)1065922697 |z (OCoLC)1086974359 |z (OCoLC)1124350583 |z (OCoLC)1127178228 |z (OCoLC)1136410292 | ||
| 050 | 4 | |a TK7871.85 |b .X53 2012 | |
| 072 | 7 | |a TEC |x 009070 |2 bisacsh | |
| 082 | 0 | 4 | |a 621.3815/2 |2 23 |
| 049 | |a UAMI | ||
| 100 | 1 | |a Xiao, Hong, |d 1961- | |
| 245 | 1 | 0 | |a Introduction to semiconductor manufacturing technology / |c Hong Xiao. |
| 250 | |a Second edition. | ||
| 264 | 1 | |a Bellingham, Wash. (1000 20th St. Bellingham WA 98225-6705 USA) : |b SPIE Press, |c [2012] | |
| 264 | 4 | |c ©2012 | |
| 300 | |a 1 online resource (xix, 656 pages) : |b illustrations | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a computer |b c |2 rdamedia | ||
| 338 | |a online resource |b cr |2 rdacarrier | ||
| 340 | |g monochrome |2 rdacc | ||
| 340 | |p illustration |2 rdaill | ||
| 347 | |a text file |2 rdaft | ||
| 490 | 1 | |a SPIE Press monograph ; |v PM220 | |
| 500 | |a "SPIE Digital Library."--Website | ||
| 504 | |a Includes bibliographical references. | ||
| 505 | 0 | |a Preface to the first edition -- Preface to the second edition -- Chapter 1. Introduction -- Chapter 2. Introduction to integrated circuit fabrication -- Chapter 3. Semiconductor basics -- Chapter 4. Wafer manufacturing, epitaxy, and substrate engineering -- Chapter 5. Thermal processes -- Chapter 6. Photolithography -- Chapter 7. Plasma basics -- Chapter 8. Ion implantation -- Chapter 9. Etch -- Chapter 10. Chemical vapor deposition and dielectric thin films -- Chapter 11. Metallization -- Chapter 12. Chemical mechanical polishing -- Chapter 13. Process integration -- Chapter 14. Integrated circuit processing technologies -- Chapter 15. Future trends and summary. | |
| 520 | |a Integrated circuit fabrication is a complex process, and engineers must have a deep understanding of the intricate technologies involved in order to be successful. This book, intended for technical and college students, provides an overview of key concepts, equipment, and techniques used in fabs today. A history of the field is included as context for modern practictioners. The second edition covers advancements made in the past decade and adds new illustrations. | ||
| 588 | 0 | |a Online resource; title from digital title page (viewed on March 26, 2020). | |
| 546 | |a English. | ||
| 590 | |a Knovel |b ACADEMIC - Electronics & Semiconductors | ||
| 650 | 0 | |a Integrated circuits |x Design and construction. | |
| 650 | 0 | |a Semiconductors |x Design and construction. | |
| 650 | 0 | |a Semiconductor industry. | |
| 650 | 6 | |a Circuits intégrés |x Conception et construction. | |
| 650 | 6 | |a Semi-conducteurs |x Industrie. | |
| 650 | 7 | |a TECHNOLOGY & ENGINEERING |x Mechanical. |2 bisacsh | |
| 650 | 7 | |a Integrated circuits |x Design and construction |2 fast | |
| 650 | 7 | |a Semiconductor industry |2 fast | |
| 650 | 7 | |a Semiconductors |x Design and construction |2 fast | |
| 710 | 2 | |a Society of Photo-Optical Instrumentation Engineers. | |
| 776 | 0 | 8 | |i Print version: |z 081949092X |z 9780819490926 |w (DLC) 2012013231 |
| 830 | 0 | |a SPIE monograph ; |v PM220. | |
| 856 | 4 | 0 | |u https://appknovel.uam.elogim.com/kn/resources/kpISTE0002/toc |z Texto completo |
| 936 | |a BATCHLOAD | ||
| 938 | |a EBSCOhost |b EBSC |n 858277 | ||
| 938 | |a Society of Photo-Optical Instrumentation Engineers |b SPIE |n 9780819490933 | ||
| 938 | |a YBP Library Services |b YANK |n 10899012 | ||
| 938 | |a ebrary |b EBRY |n ebr10776036 | ||
| 938 | |a EBL - Ebook Library |b EBLB |n EBL1120176 | ||
| 994 | |a 92 |b IZTAP | ||