Handbook of multilevel metallization for integrated circuits : materials, technology, and applications /

It is widely recognized that the successful design, development, and integration of multilevel metallization (MLM) systems is and will continue to be key to current and future VLSI technologies. All major semiconductor companies have significant ongoing research teams focused in this area. These tea...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Otros Autores: Wilson, Syd R., Tracy, Clarence J., Freeman, John L.
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Park Ridge, N.J. : Noyes Publications, ©1993.
Colección:Materials science and process technology series. Electronic materials and process technology.
Temas:
Integrated circuits > Design and construction.
Metallizing.
Circuits intégrés > Conception et construction.
Métallisation.
TECHNOLOGY & ENGINEERING > Electronics > Circuits > Integrated.
TECHNOLOGY & ENGINEERING > Electronics > Circuits > General.
Integrated circuits > Design and construction
Metallizing
Circuitos integrados.
Circuits intégrés.
Acceso en línea:Texto completo
Tabla de Contenidos:
  • 12. Electronic Packaging and Its Influences On Integrated Circuit Design and Processing / Harry K. Charles, Jr. and G. Donald Wagner
  • 13. Future Interconnect Systems / S. Simon Wong.

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