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Handbook of multilevel metallization for integrated circuits : materials, technology, and applications /
It is widely recognized that the successful design, development, and integration of multilevel metallization (MLM) systems is and will continue to be key to current and future VLSI technologies. All major semiconductor companies have significant ongoing research teams focused in this area. These tea...
| Clasificación: | Libro Electrónico |
|---|---|
| Otros Autores: | , , |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Park Ridge, N.J. :
Noyes Publications,
©1993.
|
| Colección: | Materials science and process technology series. Electronic materials and process technology.
|
| Temas: | |
| Acceso en línea: | Texto completo |
MARC
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| 245 | 0 | 0 | |a Handbook of multilevel metallization for integrated circuits : |b materials, technology, and applications / |c edited by Syd R. Wilson and Clarence J. Tracy, John L. Freeman, Jr. |
| 260 | |a Park Ridge, N.J. : |b Noyes Publications, |c ©1993. | ||
| 300 | |a 1 online resource (xxiii, 887 pages) : |b illustrations | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a computer |b c |2 rdamedia | ||
| 338 | |a online resource |b cr |2 rdacarrier | ||
| 490 | 1 | |a Materials science and process technology series. Electronic materials and process technology | |
| 504 | |a Includes bibliographical references and index. | ||
| 588 | 0 | |a Print version record. | |
| 505 | 0 | |a 12. Electronic Packaging and Its Influences On Integrated Circuit Design and Processing / Harry K. Charles, Jr. and G. Donald Wagner -- 13. Future Interconnect Systems / S. Simon Wong. | |
| 506 | |3 Use copy |f Restrictions unspecified |2 star |5 MiAaHDL | ||
| 520 | |a It is widely recognized that the successful design, development, and integration of multilevel metallization (MLM) systems is and will continue to be key to current and future VLSI technologies. All major semiconductor companies have significant ongoing research teams focused in this area. These teams must view multilevel metallization as a system rather than a collection of isolated process modules. | ||
| 520 | 8 | |a MLM teams are usually composed of unit process specialists and it is difficult for them to become generalists to solve the device, design, chemical, materials science, and analysis problems which are encountered. The engineers comprising these teams have been forced to accumulate and read large numbers of publications from each topical area to obtain a reasonably complete understanding of the numerous topics. | |
| 520 | 8 | |a The Handbook of Multilevel Metallization for Integrated Circuits answers this need by pulling together in one volume a thorough technical summary of each of the key areas that make up a multilevel metal system. Properly included are associated design, analysis, materials, and manufacturing topics. The book serves three purposes: (1) It is a good learning tool for the engineer newly assigned to work in metallization. | |
| 520 | 8 | |a All important aspects of the fully integrated process are discussed in sufficient depth such that no additional literature searches are needed. (2) It serves as a reference text for any MLM engineer, new or experienced, who needs a refresher about the specifics of a concept or process. (3) For someone who wants to further specialize in one topical area, an extensive listing of references has been provided to simplify more in-depth study. | |
| 533 | |a Electronic reproduction. |b [Place of publication not identified] : |c HathiTrust Digital Library, |d 2010. |5 MiAaHDL | ||
| 538 | |a Master and use copy. Digital master created according to Benchmark for Faithful Digital Reproductions of Monographs and Serials, Version 1. Digital Library Federation, December 2002. |u http://purl.oclc.org/DLF/benchrepro0212 |5 MiAaHDL | ||
| 583 | 1 | |a digitized |c 2010 |h HathiTrust Digital Library |l committed to preserve |2 pda |5 MiAaHDL | |
| 546 | |a English. | ||
| 590 | |a Knovel |b ACADEMIC - Electronics & Semiconductors | ||
| 650 | 0 | |a Integrated circuits |x Design and construction. | |
| 650 | 0 | |a Metallizing. | |
| 650 | 6 | |a Circuits intégrés |x Conception et construction. | |
| 650 | 6 | |a Métallisation. | |
| 650 | 7 | |a TECHNOLOGY & ENGINEERING |x Electronics |x Circuits |x Integrated. |2 bisacsh | |
| 650 | 7 | |a TECHNOLOGY & ENGINEERING |x Electronics |x Circuits |x General. |2 bisacsh | |
| 650 | 7 | |a Integrated circuits |x Design and construction |2 fast | |
| 650 | 7 | |a Metallizing |2 fast | |
| 650 | 7 | |a Circuitos integrados. |2 larpcal | |
| 650 | 7 | |a Circuits intégrés. |2 ram | |
| 700 | 1 | |a Wilson, Syd R. | |
| 700 | 1 | |a Tracy, Clarence J. | |
| 700 | 1 | |a Freeman, John L. | |
| 776 | 0 | 8 | |i Print version: |t Handbook of multilevel metallization for integrated circuits. |d Park Ridge, N.J. : Noyes Publications, ©1993 |z 0815513402 |w (DLC) 93026689 |
| 830 | 0 | |a Materials science and process technology series. |p Electronic materials and process technology. | |
| 856 | 4 | 0 | |u https://appknovel.uam.elogim.com/kn/resources/kpHMMICMTB/toc |z Texto completo |
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