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Electronics reliability and measurement technology : nondestructive evaluation /
This book examines electronics reliability and measurement technology. It identifies advances in measurement science and technology for nondestructive evaluation, and it details common measurement trouble spots.
| Clasificación: | Libro Electrónico |
|---|---|
| Otros Autores: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Park Ridge, N.J., U.S.A. :
Noyes Data Corp.,
©1988.
|
| Temas: | |
| Acceso en línea: | Texto completo |
MARC
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| 037 | |a 153734:153894 |b Elsevier Science & Technology |n http://www.sciencedirect.com | ||
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| 245 | 0 | 0 | |a Electronics reliability and measurement technology : |b nondestructive evaluation / |c edited by Joseph S. Heyman. |
| 260 | |a Park Ridge, N.J., U.S.A. : |b Noyes Data Corp., |c ©1988. | ||
| 300 | |a 1 online resource (xii, 128 pages) : |b illustrations | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a computer |b c |2 rdamedia | ||
| 338 | |a online resource |b cr |2 rdacarrier | ||
| 500 | |a "The Electronics Reliability and Measurement Technology Workshop was held in June 1986 at NASA Langley Research Center"--Page vii | ||
| 520 | |a This book examines electronics reliability and measurement technology. It identifies advances in measurement science and technology for nondestructive evaluation, and it details common measurement trouble spots. | ||
| 504 | |a Includes bibliographical references and index. | ||
| 505 | 0 | 0 | |t Measurement Science and Manufacturing Science Research -- |t Nondestructive SEM for Surface and Subsurface Wafer Imaging -- |t Surface Inspection-Research and Development -- |t Wafer Level Reliability for High-Performance VLSI Design -- |t Wafer Level Reliability Testing: an Idea Whose Time Has Come -- |t Micro-Focus X-Ray Imaging -- |t Measurement of Opaque Film Thickness -- |t Intelligent Laser Soldering Inspection and Process Control -- |t Rupture Testing for the Quality Control of Electrodeposited Copper Interconnections in High-Speed, High-Density Circuits -- |t Heterodyne Holographic Interferometry: High-Resolution Ranging and Displacement Measurement -- |t Whole Wafer Scanning Electron Microscopy. |
| 506 | |3 Use copy |f Restrictions unspecified |2 star |5 MiAaHDL | ||
| 533 | |a Electronic reproduction. |b [Place of publication not identified] : |c HathiTrust Digital Library, |d 2010. |5 MiAaHDL | ||
| 538 | |a Master and use copy. Digital master created according to Benchmark for Faithful Digital Reproductions of Monographs and Serials, Version 1. Digital Library Federation, December 2002. |u http://purl.oclc.org/DLF/benchrepro0212 |5 MiAaHDL | ||
| 583 | 1 | |a digitized |c 2010 |h HathiTrust Digital Library |l committed to preserve |2 pda |5 MiAaHDL | |
| 588 | 0 | |a Print version record. | |
| 546 | |a English. | ||
| 590 | |a Knovel |b ACADEMIC - Electronics & Semiconductors | ||
| 590 | |a Knovel |b ACADEMIC - Nondestructive Testing & Evaluation | ||
| 650 | 0 | |a Integrated circuits |x Reliability |v Congresses. | |
| 650 | 0 | |a Nondestructive testing |v Congresses. | |
| 650 | 0 | |a Integrated circuits |x Testing |v Congresses. | |
| 650 | 6 | |a Circuits intégrés |x Fiabilité |v Congrès. | |
| 650 | 6 | |a Contrôle non destructif |v Congrès. | |
| 650 | 7 | |a TECHNOLOGY & ENGINEERING |x Electronics |x Microelectronics. |2 bisacsh | |
| 650 | 7 | |a TECHNOLOGY & ENGINEERING |x Electronics |x Digital. |2 bisacsh | |
| 650 | 7 | |a Integrated circuits |x Reliability. |2 fast |0 (OCoLC)fst00975588 | |
| 650 | 7 | |a Integrated circuits |x Testing. |2 fast |0 (OCoLC)fst00975593 | |
| 650 | 7 | |a Nondestructive testing. |2 fast |0 (OCoLC)fst01430903 | |
| 650 | 7 | |a Elektronik |2 gnd | |
| 650 | 7 | |a Elektronische Schaltung |2 gnd | |
| 650 | 7 | |a Kongress |2 gnd | |
| 650 | 7 | |a Zuverlässigkeit |2 gnd | |
| 655 | 7 | |a Conference papers and proceedings. |2 fast |0 (OCoLC)fst01423772 | |
| 655 | 7 | |a Conference papers and proceedings. |2 lcgft | |
| 655 | 7 | |a Actes de congrès. |2 rvmgf | |
| 655 | 7 | |a Hampton (Va., 1986) |2 swd | |
| 700 | 1 | |a Heyman, Joseph S. | |
| 776 | 0 | 8 | |i Print version: |t Electronics reliability and measurement technology. |d Park Ridge, N.J., U.S.A. : Noyes Data Corp., ©1988 |z 081551171X |w (DLC) 88025395 |
| 856 | 4 | 0 | |u https://appknovel.uam.elogim.com/kn/resources/kpERMTNE02/toc |z Texto completo |
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