Components, packaging and manufacturing technology : selected, peer reviewed paper from 2010 International Conference on Components, Packaging and Manufacturing Technology, Sanya, China, December 9-10, 2010 /
Clasificación: | Libro Electrónico |
---|---|
Autor Corporativo: | International Conference on Components, Packaging and Manufacturing Technology Sanya Shi, China |
Otros Autores: | Wu, Yanwen (Editor ) |
Formato: | Electrónico Congresos, conferencias eBook |
Idioma: | Inglés |
Publicado: |
Stafa-Zurich, Switzerland ; Enfield, NH :
Trans Tech Publications,
©2011.
|
Colección: | Key engineering materials ;
v. 460/461. |
Temas: | |
Acceso en línea: | Texto completo |
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