Components, packaging and manufacturing technology : selected, peer reviewed paper from 2010 International Conference on Components, Packaging and Manufacturing Technology, Sanya, China, December 9-10, 2010 /

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor Corporativo: International Conference on Components, Packaging and Manufacturing Technology Sanya Shi, China
Otros Autores: Wu, Yanwen (Editor )
Formato: Electrónico Congresos, conferencias eBook
Idioma:Inglés
Publicado: Stafa-Zurich, Switzerland ; Enfield, NH : Trans Tech Publications, ©2011.
Colección:Key engineering materials ; v. 460/461.
Temas:
Electronic apparatus and appliances > Congresses.
Electronic packaging > Congresses.
Microelectronic packaging > Congresses.
Manufacturing processes > Congresses.
Mise sous boîtier (Électronique) > Congrès.
Mise sous boîtier (Microélectronique) > Congrès.
Fabrication > Congrès.
TECHNOLOGY & ENGINEERING > Engineering (General)
TECHNOLOGY & ENGINEERING > Reference.
Electronic apparatus and appliances.
Electronic packaging.
Manufacturing processes.
Microelectronic packaging.
Conference papers and proceedings.
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