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| LEADER |
00000cam a22000003a 4500 |
| 001 |
EBSCO_ocn811963183 |
| 003 |
OCoLC |
| 005 |
20231017213018.0 |
| 006 |
m o d |
| 007 |
cr |n||||||||| |
| 008 |
121004s2011 sz a ob 101 0 eng d |
| 040 |
|
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|a YDXCP
|b eng
|e pn
|c YDXCP
|d OCLCO
|d N$T
|d OCLCQ
|d OCLCF
|d OCLCO
|d OCL
|d OCLCO
|d OCLCQ
|d OCLCO
|d OCLCQ
|d AGLDB
|d OCLCQ
|d VTS
|d STF
|d M8D
|d OCLCO
|d OCLCQ
|
| 020 |
|
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|a 9783038134800
|q (electronic bk.)
|
| 020 |
|
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|a 3038134805
|q (electronic bk.)
|
| 020 |
|
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|z 9780878492138
|
| 020 |
|
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|z 0878492135
|
| 029 |
1 |
|
|a DEBSZ
|b 472762923
|
| 029 |
1 |
|
|a DEBBG
|b BV043774268
|
| 035 |
|
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|a (OCoLC)811963183
|
| 050 |
|
4 |
|a TA1
|
| 072 |
|
7 |
|a TEC
|x 009000
|2 bisacsh
|
| 072 |
|
7 |
|a TEC
|x 035000
|2 bisacsh
|
| 082 |
0 |
4 |
|a 620.005
|2 23
|
| 049 |
|
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|a UAMI
|
| 111 |
2 |
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|a International Conference on Components, Packaging and Manufacturing Technology
|d (2010 :
|c Sanya Shi, China)
|
| 245 |
1 |
0 |
|a Components, packaging and manufacturing technology :
|b selected, peer reviewed paper from 2010 International Conference on Components, Packaging and Manufacturing Technology, Sanya, China, December 9-10, 2010 /
|c edited by Yanwen Wu.
|
| 246 |
3 |
0 |
|a ICCPMT 2010
|
| 260 |
|
|
|a Stafa-Zurich, Switzerland ;
|a Enfield, NH :
|b Trans Tech Publications,
|c ©2011.
|
| 300 |
|
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|a 1 online resource (pages).
|
| 336 |
|
|
|a text
|b txt
|2 rdacontent
|
| 337 |
|
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|a computer
|b c
|2 rdamedia
|
| 338 |
|
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|a online resource
|b cr
|2 rdacarrier
|
| 490 |
1 |
|
|a Key engineering materials,
|x 1662-9795 ;
|v v. 460-461
|
| 590 |
|
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|a eBooks on EBSCOhost
|b EBSCO eBook Subscription Academic Collection - Worldwide
|
| 650 |
|
0 |
|a Electronic apparatus and appliances
|v Congresses.
|
| 650 |
|
0 |
|a Electronic packaging
|v Congresses.
|
| 650 |
|
0 |
|a Microelectronic packaging
|v Congresses.
|
| 650 |
|
0 |
|a Manufacturing processes
|v Congresses.
|
| 650 |
|
6 |
|a Mise sous boîtier (Électronique)
|v Congrès.
|
| 650 |
|
6 |
|a Mise sous boîtier (Microélectronique)
|v Congrès.
|
| 650 |
|
6 |
|a Fabrication
|v Congrès.
|
| 650 |
|
7 |
|a TECHNOLOGY & ENGINEERING
|x Engineering (General)
|2 bisacsh
|
| 650 |
|
7 |
|a TECHNOLOGY & ENGINEERING
|x Reference.
|2 bisacsh
|
| 650 |
|
7 |
|a Electronic apparatus and appliances.
|2 fast
|0 (OCoLC)fst00906772
|
| 650 |
|
7 |
|a Electronic packaging.
|2 fast
|0 (OCoLC)fst00907414
|
| 650 |
|
7 |
|a Manufacturing processes.
|2 fast
|0 (OCoLC)fst01008139
|
| 650 |
|
7 |
|a Microelectronic packaging.
|2 fast
|0 (OCoLC)fst01019751
|
| 655 |
|
7 |
|a Conference papers and proceedings.
|2 fast
|0 (OCoLC)fst01423772
|
| 700 |
1 |
|
|a Wu, Yanwen.
|4 edt
|
| 776 |
0 |
8 |
|i Print version:
|z 9780878492138
|z 0878492135
|w (DLC) 2011414054
|w (OCoLC)722384684
|
| 830 |
|
0 |
|a Key engineering materials ;
|v v. 460/461.
|
| 856 |
4 |
0 |
|u https://ebsco.uam.elogim.com/login.aspx?direct=true&scope=site&db=nlebk&AN=553046
|z Texto completo
|
| 938 |
|
|
|a EBSCOhost
|b EBSC
|n 553046
|
| 938 |
|
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|a YBP Library Services
|b YANK
|n 9700722
|
| 994 |
|
|
|a 92
|b IZTAP
|
