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Reflow soldering processes : SMT, BGA, CSP and flip chip technologies /
Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared towa...
| Clasificación: | Libro Electrónico |
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| Autor principal: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Boston :
Newnes,
©2002.
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| Temas: | |
| Acceso en línea: | Texto completo |