Advances in embedded and fan-out wafer level packaging technologies /
Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging "FO-WLP" technologies have been developed across the industry over the...
Clasificación: | Libro Electrónico |
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Otros Autores: | , |
Formato: | Electrónico eBook |
Idioma: | Inglés |
Publicado: |
Hoboken, NJ, USA :
John Wiley & Sons, Inc.,
2019.
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Temas: | |
Acceso en línea: | Texto completo |
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