11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany /
Collection of selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany. The 16 papers are grouped as follows: Chapter 1: Development and Prototyping, Chapter 2: Printing Technologies, Chapter 3: Mat...
Clasificación: | Libro Electrónico |
---|---|
Autor Corporativo: | International Congress Molded Interconnect Devices Nuremberg, Germany, and Fuerth, Germany |
Otros Autores: | Franke, Jörg (Prof. Dr.-Ing.) (Editor ) |
Formato: | Electrónico Congresos, conferencias eBook |
Idioma: | Inglés |
Publicado: |
Pfaffikon, Switzerland :
TTP,
2014.
|
Colección: | Advanced materials research ;
v. 1038. |
Temas: | |
Acceso en línea: | Texto completo |
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