11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany /

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Collection of selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany. The 16 papers are grouped as follows: Chapter 1: Development and Prototyping, Chapter 2: Printing Technologies, Chapter 3: Mat...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor Corporativo: International Congress Molded Interconnect Devices Nuremberg, Germany, and Fuerth, Germany
Otros Autores: Franke, Jörg (Prof. Dr.-Ing.) (Editor )
Formato: Electrónico Congresos, conferencias eBook
Idioma:Inglés
Publicado: Pfaffikon, Switzerland : TTP, 2014.
Colección:Advanced materials research ; v. 1038.
Temas:
Molded interconnect devices.
Three-dimensional display systems > Congresses.
Affichage tridimensionnel > Congrès.
TECHNOLOGY & ENGINEERING > Mechanical.
Molded interconnect devices
Three-dimensional display systems
Conference papers and proceedings
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