11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany /

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Collection of selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany. The 16 papers are grouped as follows: Chapter 1: Development and Prototyping, Chapter 2: Printing Technologies, Chapter 3: Mat...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor Corporativo: International Congress Molded Interconnect Devices Nuremberg, Germany, and Fuerth, Germany
Otros Autores: Franke, Jörg (Prof. Dr.-Ing.) (Editor )
Formato: Electrónico Congresos, conferencias eBook
Idioma:Inglés
Publicado: Pfaffikon, Switzerland : TTP, 2014.
Colección:Advanced materials research ; v. 1038.
Temas:
Molded interconnect devices.
Three-dimensional display systems > Congresses.
Affichage tridimensionnel > Congrès.
TECHNOLOGY & ENGINEERING > Mechanical.
Molded interconnect devices
Three-dimensional display systems
Conference papers and proceedings
Acceso en línea:Texto completo
Descripción
Sumario:Collection of selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany. The 16 papers are grouped as follows: Chapter 1: Development and Prototyping, Chapter 2: Printing Technologies, Chapter 3: Materials and Manufacturing, Chapter 4: Manufacturing Processes, Chapter 5: Assembly Technologies and Inspection, Chapter 6: Quality and Reliability. Keyword: Printing Technologies, Materiala Manufacturing, Manufatruting processes, Inspection, assemply technologies, quality testing The 16 papers collected here are from the 11th International Congress Molded Interconnect Devices (MID 2014), held in September 2014 in Nuremberg/Fuerth, Germany. Technology specialists from Europe, the US, and Taiwan address development and prototyping, printing technologies, materials and manufacturing, manufacturing processes, assembly technologies and inspection, and quality and reliability. -- Electronic components and devices-- Electronic engineering-- Materials science.
Descripción Física:1 online resource (119 pages) : illustrations
Bibliografía:Includes bibliographical references at the end of each chapters and index.
ISBN:9783038266365
3038266361
ISSN:1662-8985 ;
1662-8985

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