Lithography /

Lithography is now a complex tool at the heart of a technological process for manufacturing micro and nanocomponents. A multidisciplinary technology, lithography continues to push the limits of optics, chemistry, mechanics, micro and nano-fluids, etc. This book deals with essential technologies and...

Descripción completa

Detalles Bibliográficos
Clasificación:Libro Electrónico
Otros Autores: Landis, Stefan
Formato: Electrónico eBook
Idioma:Inglés
Publicado: London : Wiley, 2013.
Colección:ISTE.
Temas:
Microlithography.
Microlithographie.
TECHNOLOGY & ENGINEERING > Electronics > Circuits > General.
Microlithography
Acceso en línea:Texto completo

MARC

LEADER 00000cam a2200000Mi 4500
001 EBOOKCENTRAL_ocn830161630
003 OCoLC
005 20240329122006.0
006 m o d
007 cr cnu---unuuu
008 130316s2013 enk o 000 0 eng d
040 |a EBLCP  |b eng  |e pn  |c EBLCP  |d YDXCP  |d N$T  |d DG1  |d OCLCF  |d OCLCQ  |d DEBSZ  |d OCLCQ  |d DEBBG  |d DG1  |d LIP  |d MERUC  |d ZCU  |d OCLCQ  |d ICG  |d OCLCQ  |d U3W  |d OCLCQ  |d DKC  |d OCLCQ  |d OCLCO  |d OCLCQ  |d OCLCO 
019 |a 992867191 
020 |a 9781118557662  |q (electronic bk.) 
020 |a 1118557662  |q (electronic bk.) 
020 |a 9781118621233  |q (electronic bk.) 
020 |a 1118621239  |q (electronic bk.) 
029 1 |a AU@  |b 000055878909 
029 1 |a CHBIS  |b 010026684 
029 1 |a CHNEW  |b 000941492 
029 1 |a CHVBK  |b 480217688 
029 1 |a DEBBG  |b BV043395626 
029 1 |a DEBBG  |b BV044174047 
029 1 |a DEBSZ  |b 431356661 
029 1 |a DEBSZ  |b 485034573 
029 1 |a NZ1  |b 15922031 
035 |a (OCoLC)830161630  |z (OCoLC)992867191 
050 4 |a TK7872.M3  |b L58 2013 
072 7 |a TEC  |x 008010  |2 bisacsh 
082 0 4 |a 621.3815/31  |a 621.381531 
049 |a UAMI 
245 0 0 |a Lithography /  |c edited by Stefan Landis. 
260 |a London :  |b Wiley,  |c 2013. 
300 |a 1 online resource (405 pages) 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
490 1 |a ISTE 
588 0 |a Print version record. 
505 0 |a Cover; Title Page; Copyright Page; Table of Contents; Foreword; Introduction; Chapter 1. Photolithography; 1.1. Introduction; 1.2. Principles and technology of scanners; 1.2.1. Illumination; 1.2.2. The mask or reticle; 1.2.3. Projection optics; 1.2.4. Repeated projection and scanning projection; 1.3. Lithography processes; 1.3.1. Anti-reflective coating; 1.3.2. Resists; 1.3.3. Barrier layers or top coating -- 1.4. Immersion photolithography; 1.4.1. Immersion lithography; 1.4.2. Resolution improvement; 1.4.3. Relevance of immersion lithography; 1.4.4. Immersion liquids. 
505 8 |a 1.4.5. Immersion scanners1.4.6. Immersion specific constraints and issues; 1.5. Image formation; 1.6. Lithography performances enhancement techniques; 1.6.1. Off axis illumination (OAI); 1.6.2. Optical proximity corrections (OPC); 1.6.3. Phase shift masks (PSM); 1.7. Contrast; 1.7.1. Polarized light contrast; 1.7.2. Influence of contrast on roughness; 1.8. Bibliography; Chapter 2. Extreme Ultraviolet Lithography; 2.1. Introduction to extreme ultraviolet lithography; 2.1.1. Chapter introduction. 
505 8 |a 2.1.2. Extreme ultraviolet lithography: the successor of optical lithography at 248 nm and 193 nm wavelengths2.1.3. The spectral range of extreme ultraviolet; 2.1.4. Choice of wavelength and resolution limit for EUV lithography; 2.2. The electromagnetic properties of materials and the complex index; 2.2.1. Wave vector and complex index; 2.2.2. Scattering and absorption: the electromagnetic origin of the refractive index; 2.2.3. Light propagation and refractive index; 2.2.4. Reflection and transmission of a monochromatic wave; 2.3. Reflective optical elements for EUV lithography. 
505 8 |a 2.3.1. The interferential mirror principle: Bragg structure2.3.2. Reflective optics: conception and fabrication; 2.3.3. Projection optics for EUV lithography; 2.4. Reflective masks for EUV lithography; 2.4.1. Different mask types; 2.4.2. Manufacturing processes for EUV masks; 2.4.3. Mask defectivity; 2.5. Modeling and simulation for EUV lithography; 2.5.1. Simulation, a conceptional tool; 2.5.2. Simulation methods; 2.6. EUV lithography sources; 2.6.1. Constitutive elements of a plasma source; 2.6.2. Specifications for an EUV source; 2.6.3. EUV sources; 2.7. Conclusion. 
505 8 |a 2.8. Appendix: Kramers-Krönig relationship2.9. Bibliography; Chapter 3. Electron Beam Lithography; 3.1. Introduction; 3.2. Different equipment, its operation and limits: current and future solutions; 3.2.1. Gaussian beam; 3.2.2. Shaped electron beam; 3.2.3. Multi-electron beam; 3.3. Maskless photolithography; 3.3.1. Optical lithography without a mask; 3.3.2. Charged particle maskless lithography; 3.4. Alignment; 3.5. Electron-sensitive resists; 3.6. Electron-matter interaction; 3.7. Physical effect of electronic bombardment in the target; 3.7.1. Polymerizing, chemical bond breaking. 
500 |a 3.7.2. Thermal effect. 
520 |a Lithography is now a complex tool at the heart of a technological process for manufacturing micro and nanocomponents. A multidisciplinary technology, lithography continues to push the limits of optics, chemistry, mechanics, micro and nano-fluids, etc. This book deals with essential technologies and processes, primarily used in industrial manufacturing of microprocessors and other electronic components. 
590 |a ProQuest Ebook Central  |b Ebook Central Academic Complete 
650 0 |a Microlithography. 
650 6 |a Microlithographie. 
650 7 |a TECHNOLOGY & ENGINEERING  |x Electronics  |x Circuits  |x General.  |2 bisacsh 
650 7 |a Microlithography  |2 fast 
700 1 |a Landis, Stefan. 
776 0 8 |i Print version:  |a Landis, Stefan.  |t Lithography.  |d London : Wiley, ©2013  |z 9781848212022 
830 0 |a ISTE. 
856 4 0 |u https://ebookcentral.uam.elogim.com/lib/uam-ebooks/detail.action?docID=1143629  |z Texto completo 
938 |a EBL - Ebook Library  |b EBLB  |n EBL1143629 
938 |a EBSCOhost  |b EBSC  |n 561347 
938 |a YBP Library Services  |b YANK  |n 10349690 
994 |a 92  |b IZTAP 

Ejemplares similares