Modeling and simulation for microelectronic packaging assembly : manufacturing, reliability, and testing /

"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"--

Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor principal: Liu, S. (Sheng), 1963-
Otros Autores: Liu, Yong, 1962-
Formato: Electrónico eBook
Idioma:Inglés
Publicado: [Beijing] : Singapore : Chemical Industry Press ; Wiley, 2011.
Temas:
Microelectronic packaging > Simulation methods.
Mise sous boîtier (Microélectronique) > Méthodes de simulation.
TECHNOLOGY & ENGINEERING > Electronics > Circuits > General.
Electrical & Computer Engineering.
Engineering & Applied Sciences.
Electrical Engineering.
Acceso en línea:Texto completo
Tabla de Contenidos:
  • Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing; Contents; Foreword by C.P. Wong; Foreword by Zhigang Suo; Preface; Acknowledgments; About the Authors; Part I: Mechanics and Modeling; 1 Constitutive Models and Finite Element Method; 1.1 Constitutive Models for Typical Materials; 1.1.1 Linear Elasticity; 1.1.2 Elastic-Visco-Plasticity; 1.2 Finite Element Method; 1.2.1 Basic Finite Element Equations; 1.2.2 Nonlinear Solution Methods; 1.2.3 Advanced Modeling Techniques in Finite Element Analysis.

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