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Modeling and simulation for microelectronic packaging assembly : manufacturing, reliability, and testing /

"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"--

Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor principal: Liu, S. (Sheng), 1963-
Otros Autores: Liu, Yong, 1962-
Formato: Electrónico eBook
Idioma:Inglés
Publicado: [Beijing] : Singapore : Chemical Industry Press ; Wiley, 2011.
Temas:
Acceso en línea:Texto completo