Modeling and simulation for microelectronic packaging assembly : manufacturing, reliability, and testing /
"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"--
Clasificación: | Libro Electrónico |
---|---|
Autor principal: | Liu, S. (Sheng), 1963- |
Otros Autores: | Liu, Yong, 1962- |
Formato: | Electrónico eBook |
Idioma: | Inglés |
Publicado: |
[Beijing] : Singapore :
Chemical Industry Press ; Wiley,
2011.
|
Temas: | |
Acceso en línea: | Texto completo |
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