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Modeling and simulation for microelectronic packaging assembly : manufacturing, reliability, and testing /
"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"--
| Clasificación: | Libro Electrónico |
|---|---|
| Autor principal: | |
| Otros Autores: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
[Beijing] : Singapore :
Chemical Industry Press ; Wiley,
2011.
|
| Temas: | |
| Acceso en línea: | Texto completo |
MARC
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| 100 | 1 | |a Liu, S. |q (Sheng), |d 1963- | |
| 245 | 1 | 0 | |a Modeling and simulation for microelectronic packaging assembly : |b manufacturing, reliability, and testing / |c Sheng Liu, Yong Liu. |
| 260 | |a [Beijing] : |b Chemical Industry Press ; |a Singapore : |b Wiley, |c 2011. | ||
| 300 | |a 1 online resource (xxii, 564 pages) : |b illustrations | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a computer |b c |2 rdamedia | ||
| 338 | |a online resource |b cr |2 rdacarrier | ||
| 520 | |a "This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"-- |c Provided by publisher. | ||
| 504 | |a Includes bibliographical references and index. | ||
| 505 | 0 | |a Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing; Contents; Foreword by C.P. Wong; Foreword by Zhigang Suo; Preface; Acknowledgments; About the Authors; Part I: Mechanics and Modeling; 1 Constitutive Models and Finite Element Method; 1.1 Constitutive Models for Typical Materials; 1.1.1 Linear Elasticity; 1.1.2 Elastic-Visco-Plasticity; 1.2 Finite Element Method; 1.2.1 Basic Finite Element Equations; 1.2.2 Nonlinear Solution Methods; 1.2.3 Advanced Modeling Techniques in Finite Element Analysis. | |
| 590 | |a ProQuest Ebook Central |b Ebook Central Academic Complete | ||
| 650 | 0 | |a Microelectronic packaging |x Simulation methods. | |
| 650 | 6 | |a Mise sous boîtier (Microélectronique) |x Méthodes de simulation. | |
| 650 | 7 | |a TECHNOLOGY & ENGINEERING |x Electronics |x Circuits |x General. |2 bisacsh | |
| 650 | 7 | |a Electrical & Computer Engineering. |2 hilcc | |
| 650 | 7 | |a Engineering & Applied Sciences. |2 hilcc | |
| 650 | 7 | |a Electrical Engineering. |2 hilcc | |
| 700 | 1 | |a Liu, Yong, |d 1962- | |
| 758 | |i has work: |a Modeling and simulation for microelectronic packaging assembly (Text) |1 https://id.oclc.org/worldcat/entity/E39PCFtgMcRcGw79PF7WM7JVqP |4 https://id.oclc.org/worldcat/ontology/hasWork | ||
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