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Modeling and simulation for microelectronic packaging assembly : manufacturing, reliability, and testing /
"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"--
| Clasificación: | Libro Electrónico |
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| Autor principal: | |
| Otros Autores: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
[Beijing] : Singapore :
Chemical Industry Press ; Wiley,
2011.
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| Temas: | |
| Acceso en línea: | Texto completo |
| Sumario: | "This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"-- |
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| Descripción Física: | 1 online resource (xxii, 564 pages) : illustrations |
| Bibliografía: | Includes bibliographical references and index. |
| ISBN: | 0470827815 9780470827819 9780470827826 0470827823 9780470828410 0470828412 9781118082829 1118082826 |