LED packaging for lighting applications : design, manufacturing, and testing /

"This book provides quantitative methods for optical, thermal, reliability modelling and simulation so that predictive quantitative modelling can be achieved"--

Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor principal: Liu, S. (Sheng), 1963-
Otros Autores: Luo, Xiaobing, 1974-
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Hoboken, N.J. : Wiley, 2011.
Temas:
Light emitting diodes > Design and construction.
Light emitting diodes > Computer simulation.
Electronic packaging.
Electric lighting > Equipment and supplies.
Diodes électroluminescentes > Simulation par ordinateur.
Mise sous boîtier (Électronique)
TECHNOLOGY & ENGINEERING > Electronics > Circuits > General.
TECHNOLOGY & ENGINEERING > Electronics > Semiconductors.
TECHNOLOGY & ENGINEERING > Electronics > Solid State.
Electric lighting > Equipment and supplies
Electronic packaging
Acceso en línea:Texto completo
Tabla de Contenidos:
  • Front Matter
  • Introduction
  • Fundamentals and Development Trends of High Power LED Packaging
  • Optical Design of High Power LED Packaging Module
  • Thermal Management of High Power LED Packaging Module
  • Reliability Engineering of High Power LED Packaging
  • Design of LED Packaging Applications
  • LED Measurement and Standards
  • Appendix: Measurement Method for Integral LED Road Lights Approved by China Solid State Lighting Alliance
  • Index.

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