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LED packaging for lighting applications : design, manufacturing, and testing /

"This book provides quantitative methods for optical, thermal, reliability modelling and simulation so that predictive quantitative modelling can be achieved"--

Detalles Bibliográficos
Clasificación:	Libro Electrónico
Autor principal:	Liu, S. (Sheng), 1963-
Otros Autores:	Luo, Xiaobing, 1974-
Formato:	Electrónico eBook
Idioma:	Inglés
Publicado:	Hoboken, N.J. : Wiley, 2011.
Temas:	Light emitting diodes > Design and construction. Light emitting diodes > Computer simulation. Electronic packaging. Electric lighting > Equipment and supplies. Diodes électroluminescentes > Simulation par ordinateur. Mise sous boîtier (Électronique) TECHNOLOGY & ENGINEERING > Electronics > Circuits > General. TECHNOLOGY & ENGINEERING > Electronics > Semiconductors. TECHNOLOGY & ENGINEERING > Electronics > Solid State. Electric lighting > Equipment and supplies Electronic packaging
Acceso en línea:	Texto completo

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