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Introduction to microfabrication /
This accessible text is now fully revised and updated, providing an overview of fabrication technologies and materials needed to realize modern microdevices. It demonstrates how common microfabrication principles can be applied in different applications, to create devices ranging from nanometer prob...
| Clasificación: | Libro Electrónico |
|---|---|
| Autor principal: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Chichester, West Sussex, England ; Hoboken, NJ :
John Wiley & Sons,
2010.
|
| Edición: | 2nd ed. |
| Temas: | |
| Acceso en línea: | Texto completo |
MARC
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| 100 | 1 | |a Franssila, Sami. | |
| 245 | 1 | 0 | |a Introduction to microfabrication / |c Sami Franssila. |
| 250 | |a 2nd ed. | ||
| 260 | |a Chichester, West Sussex, England ; |a Hoboken, NJ : |b John Wiley & Sons, |c 2010. | ||
| 300 | |a 1 online resource (xiv, 518 pages) : |b illustrations | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a computer |b c |2 rdamedia | ||
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| 505 | 0 | |6 880-01 |a Micrometrology and Materials Characterization -- Simulation of Microfabrication Processes -- Silicon -- Thin-Film Materials and Processes -- Epitaxy -- Advanced Thin Films -- Pattern Generation -- Optical Lithography -- Advanced Lithography -- Etching -- Wafer Cleaning and Surface Preparation -- Thermal Oxidation -- Diffusion -- Ion Implantation -- CMP: Chemical₆Mechanical Polishing -- Bonding -- Polymer Microprocessing -- Glass Microprocessing -- Anisotropic Wet Etching -- Deep Reactive Ion Etching -- Wafer Engineering -- Special Processes and Materials -- Serial Microprocessing -- Process Integration -- MOS Transistor Fabrication -- Bipolar Transistors -- Multilevel Metallization -- Surface Micromachining -- MEMS Process Integration -- Process Equipment -- Equipment for Hot Processes -- Vacuum and Plasmas -- CVD and Epitaxy Equipment -- Cleanrooms -- Yield and Reliability -- Economics of Microfabrication -- Moore's Law and Scaling Trends -- Microfabrication at Large -- Appendix A: Properties of Silicon -- Appendix B: Constants and Conversion Factors -- Appendix C: Oxide and Nitride Thickness by Color. | |
| 520 | |a This accessible text is now fully revised and updated, providing an overview of fabrication technologies and materials needed to realize modern microdevices. It demonstrates how common microfabrication principles can be applied in different applications, to create devices ranging from nanometer probe tips to meter scale solar cells, and a host of microelectronic, mechanical, optical and fluidic devices in between. Latest developments in wafer engineering, patterning, thin films, surface preparation and bonding are covered. | ||
| 588 | 0 | |a Print version record. | |
| 504 | |a Includes bibliographical references and index. | ||
| 546 | |a English. | ||
| 590 | |a ProQuest Ebook Central |b Ebook Central Academic Complete | ||
| 650 | 0 | |a Microelectromechanical systems. | |
| 650 | 0 | |a Electronic apparatus and appliances. | |
| 650 | 0 | |a Microfabrication. | |
| 650 | 2 | |a Micro-Electrical-Mechanical Systems | |
| 650 | 6 | |a Microsystèmes électromécaniques. | |
| 650 | 6 | |a Microfabrication. | |
| 650 | 7 | |a TECHNOLOGY & ENGINEERING |x Electronics |x Microelectronics. |2 bisacsh | |
| 650 | 7 | |a TECHNOLOGY & ENGINEERING |x Electronics |x Digital. |2 bisacsh | |
| 650 | 7 | |a Electronic apparatus and appliances |2 fast | |
| 650 | 7 | |a Microelectromechanical systems |2 fast | |
| 650 | 7 | |a Microfabrication |2 fast | |
| 758 | |i has work: |a Introduction to microfabrication (Text) |1 https://id.oclc.org/worldcat/entity/E39PCGYj9kJVRXkrjtX69pQkQq |4 https://id.oclc.org/worldcat/ontology/hasWork | ||
| 776 | 0 | 8 | |i Print version: |a Franssila, Sami. |t Introduction to microfabrication. |b 2nd ed. |d Chichester, West Sussex, England ; Hoboken, NJ : John Wiley & Sons, 2010 |z 9780470749838 |w (DLC) 2010010076 |w (OCoLC)560554895 |
| 856 | 4 | 0 | |u https://ebookcentral.uam.elogim.com/lib/uam-ebooks/detail.action?docID=589187 |z Texto completo |
| 880 | 0 | 0 | |6 505-01/(S |g Machine generated contents note: |g 1. |t Introduction -- |t Substrates -- |t Thin Films -- |t Processes -- |t Dimensions -- |t Devices -- |t MOS Transistor -- |t Cleanliness and Yield -- |t Industries -- |t Exercises References and Related Reading -- |g 2. |t Micrometrology and Materials Characterization -- |t Microscopy and Visualization -- |t Lateral and Vertical Dimensions -- |t Optical Techniques -- |t Electrical Measurements -- |t Physical and Chemical Analyses -- |t Practical Issues with Micrometrology -- |t Measurements Everywhere -- |t Exercises References and Related Reading -- |g 3. |t Simulation of Microfabrication Processes -- |t Simulator Types -- |t Levels of Simulation -- |t 1D Simulators -- |t 2D Simulators -- |t 3D Simulators -- |t Other Simulation Needs in Microfabrication -- |t Exercises References and Related Reading -- |g 4. |t Silicon -- |t Silicon Material Properties -- |t Silicon Crystal Growth -- |t Silicon Crystal Structure -- |t Silicon Wafering Process -- |t Defects and Non-Idealities in Silicon Crystals -- |t Advanced Wafers -- |t Exercises References and Related Reading -- |g 5. |t Thin-Film Materials and Processes -- |t Thin Films vs. Bulk Materials -- |t Physical Vapor Deposition -- |t Chemical Vapor Deposition -- |t PECVD: Plasma-Enhanced CVD -- |t ALD: Atomic Layer Deposition -- |t Electrochemical Deposition (ECD) -- |t Other Methods -- |t Thin Films Over Topography: Step Coverage -- |t Stresses -- |t Metallic Thin Films -- |t Polysilicon -- |t Oxide and Nitride Thin Films -- |t Polymer Films -- |t Advanced Thin Films -- |t Exercises References and Related Reading -- |g 6. |t Epitaxy -- |t Heteroepitaxy -- |t Epitaxial Deposition -- |t CVD Homoepitaxy of Silicon -- |t Doping of Epilayers -- |t Measurement of Epitaxial Deposition -- |t Simulation of Epitaxy -- |t Advanced Epitaxy -- |t Exercises References and Related Reading -- |g 7. |t Advanced Thin Films -- |t General Features of Thin-Film Processes -- |t Film Growth and Structure -- |t Thin-Film Structure Characterization -- |t Surfaces and Interfaces -- |t Adhesion -- |t Two-Layer Films -- |t Alloys and Doped Films -- |t Multilayer Films -- |t Selective Deposition -- |t Reacted Films -- |t Simulation of Deposition -- |t Thickness Limits of Thin Films -- |t Exercises References and Related Reading -- |g 8. |t Pattern Generation -- |t Pattern Generators -- |t Electron Beam Lithography -- |t Laser Pattern Generators -- |t Photomask Fabrication -- |t Photomask Inspection -- |t Defects and Repair -- |t Photomasks as Tools -- |t Other Pattern Generation Methods -- |t Exercises References and Related Reading -- |g 9. |t Optical Lithography -- |t Lithography Process Flow -- |t Resist Chemistry -- |t Resist Application -- |t Alignment and Overlay -- |t Exposure -- |t Resist Profile -- |t Resolution -- |t Process Latitude -- |t Basic Pattern Shapes -- |t Lithography Practice -- |t Photoresist Stripping -- |t Exercises References and Related Reading -- |g 10. |t Advanced Lithography -- |t Projection Optical Systems -- |t Resolution of Projection Optical Systems -- |t Resists -- |t Thin-Film Optics in Resists -- |t Lithography Over Steps -- |t Optical Extensions of Optical Lithography -- |t Non-Optical Extension of Optical Lithography -- |t Lithography Simulation -- |t Lithography Triangles -- |t Exercises References and Related Reading -- |g 11. |t Etching -- |t Etch Mechanisms -- |t Etching Profiles -- |t Anisotropic Wet Etching -- |t Wet Etching -- |t Plasma Etching (RIE) -- |t Isotropic Dry Etching -- |t Etch Masks -- |t Non-Masked Etching -- |t Multistep and Multilayer Etching -- |t Etch Processes for Common Materials -- |t Ion Beam Etching -- |t Etch Process Characteristics -- |t Selecting Etch Processes -- |t Exercises References and Related Reading -- |g 12. |t Wafer Cleaning and Surface Preparation -- |t Classes of Contamination -- |t Chemical Wet Cleaning -- |t Physical Wet Cleaning -- |t Rinsing and Drying -- |t Dry Cleaning -- |t Particle Removal -- |t Organics Removal -- |t Metal Removal -- |t Contact Angle -- |t Surface Preparation -- |t Exercises References and Related Reading -- |g 13. |t Thermal Oxidation -- |t Thermal Oxidation Process -- |t Deal-Grove Oxidation Model -- |t Oxidation of Polysilicon -- |t Oxide Structure -- |t Local Oxidation of Silicon -- |t Stress and Pattern Effects in Oxidation -- |t Simulation of Oxidation -- |t Thermal Oxides vs. other Oxides -- |t Exercises References and Related Reading -- |g 14. |t Diffusion -- |t Diffusion Process -- |t Diffusion Mechanisms -- |t Doping of Polysilicon -- |t Doping Profiles in Diffusion -- |t Diffusion Applications -- |t Simulation of Diffusion -- |t Diffusion at Large -- |t Exercises References and Related Reading -- |g 15. |t Ion Implantation -- |t Implantation Process -- |t Implant Applications -- |t Implant Damage and Damage Annealing -- |t Tools for Ion Implantation -- |t Ion Implantation Simulation -- |t Implantation Further -- |t Exercises References and Related Reading -- |g 16. |t CMP: Chemical-Mechanical Polishing -- |t CMP Process and Tool -- |t Mechanics of CMP -- |t Chemistry of CMP -- |t Non-Idealities in CMP -- |t Monitoring CMP Processes -- |t Applications of CMP -- |t CMP as a Whole -- |t Exercises References and Related Reading -- |g 17. |t Bonding -- |t Bonding Basics -- |t Fusion Bonding Blanket Silicon Wafers -- |t Anodic Bonding -- |t Metallic Bonding -- |t Adhesive Bonding -- |t Layer Transfer and Temporary Bonding -- |t Bonding of Structured Wafers -- |t Bond Quality Measurements -- |t Bonding for Packaging -- |t Bonding at Large -- |t Exercises References and Related Reading -- |g 18. |t Polymer Microprocessing -- |t Polymer Materials -- |t Polymer Thermal Properties -- |t Thick-Resist Lithography -- |t Molding Techniques -- |t Hot Embossing -- |t Nanoimprint Lithography -- |t Masters for Replication -- |t Processing on Polymers -- |t Polymer Bonding -- |t Polymer Devices -- |t Polymer Overview -- |t Exercises References and Related Reading -- |g 19. |t Glass Microprocessing -- |t Structure and Properties of Glasses -- |t Glass Substrates -- |t General Processing Issues with Glasses -- |t Glass Etching -- |t Glass Bonding -- |t Glass Devices -- |t Specialty Glasses -- |t Exercises References and Related Reading -- |g 20. |t Anisotropic Wet Etching -- |t Basic Structures on <100> Silicon -- |t Etchants -- |t Etch Masks and Protective Coatings -- |t Etch Rate and Etch Stop -- |t Front-Side Processed Structures -- |t Convex Corner Etching -- |t Membrane Fabrication -- |t Through-Wafer Structures -- |t <110<Etching -- |t <111> Silicon Etching -- |t Comparison of <100> -- |t <110> and <111> Etching -- |t Exercises References and Related Reading -- |g 21. |t Deep Reactive Ion Etching -- |t RIE Process Capabilities -- |t RIE Process Physics and Chemistry -- |t Deep Etching -- |t Combining Anistropic and Isotropic DRIE -- |t Microneedles and Nozzles -- |t Sidewall Quality -- |t Pattern Size and Pattern Density Effects -- |t Etch Residues and Damage -- |t DRIE vs. |
| 880 | 0 | 0 | |t Wet Etching -- |t Exercises References and Related Reading -- |g 22. |t Wafer Engineering -- |t Silicon Crystals -- |t Gettering -- |t Wafer Mechanical Specifications -- |t Epitaxial Wafers -- |t SOI Wafers -- |t Bonding Mechanics -- |t Advanced Wafers -- |t Variety of Wafers -- |t Exercises References and Further Reading -- |g 23. |t Special Processes and Materials -- |t Substrates other than Silicon -- |t Pattern Generation -- |t Patterning -- |t Powder Blasting -- |t Deposition -- |t Porous Silicon -- |t Molding with Lost Mold -- |t Exercises References and Related Reading -- |g 24. |t Serial Microprocessing -- |t Focused Ion Beam (FIB) Processing -- |t Focused Electron Beam (FEB) Processing -- |t Laser Direct Writing -- |t AFM Patterning -- |t Ink Jetting -- |t Mechanical Structuring -- |t Chemical and Chemomechanical Machining Scaled Down -- |t Conclusions -- |t Exercises References and Further Reading -- |g 25. |t Process Integration -- |t Two Sides of the Wafer -- |t Device Example 1: Solar Cell -- |t Device Example 2: Microfluidic Sieves -- |t Wafer Selection -- |t Masks and Lithography -- |t Design Rules -- |t Resistors -- |t Device Example 3: PCR Reactor -- |t Device Example 4: Integrated Passive Chip -- |t Contamination Budget -- |t Thermal Processes -- |t Metallization -- |t Passivation and Packaging -- |t Exercises References and Related Reading -- |g 26. |t MOS Transistor Fabrication -- |t Polysilicon Gate CMOS -- |t Polysilicon Gate CMOS: 10μm to 1μm Generations -- |t MOS Transistor Scaling -- |t CMOS from 0.8μm to 65nm -- |t Gate Module -- |t SOI MOSFETs -- |t Thin-Film Transistors -- |t Integrated Circuits -- |t Exercises References and Related Reading -- |g 27. |t Bipolar Transistors -- |t Fabrication Process of SBC Bipolar Transistor -- |t Advanced Bipolar Structures -- |t Lateral Isolation -- |t BiCMOS Technology -- |t Cost of Integration -- |t Exercises References and Related Reading -- |g 28. |t Multilevel Metallization -- |t Two-Level Metallization -- |t Planarized Multilevel Metallization -- |t Copper Metallization -- |t Dual Damascene Metallization -- |t Low-k Dielectrics -- |t Metallization Scaling -- |t Exercises References and Related Reading -- |g 29. |t Surface Micromachining -- |t Single Structural Layer Devices -- |t Materials for Surface Micromachining -- |t Mechanics of Free-Standing Films -- |t Cantilever Structures -- |t Membranes and Bridges -- |t Stiction -- |t Multiple Layer Structures -- |t Rotating Structures -- |t Hinged Structures -- |t CMOS Wafers as Substrates -- |t Exercises References and Related Reading -- |g 30. |t MEMS Process Integration -- |t Silicon Microbridges -- |t Double-Sided Processing -- |t Membrane Structures -- |t Piezoresistive Pressure Sensor -- |t Tilting and Bending Through-Wafer Etched Structures -- |t Needles and Tips -- |t Channels and Nozzles -- |t Bonded Structures -- |t Surface Micromachining Combined with Bulk Micromachining -- |t MEMS Packaging -- |t Microsystems -- |t Exercises References and Related Reading -- |g 31. |t Process Equipment -- |t Batch Processing vs. Single Wafer Processing -- |t Process Regimes: Temperature and Pressure -- |t Cluster Tools and Integrated Processing -- |t Measuring Fabrication Processes -- |t Equipment Figures of Merit. |
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