Solder Joint Reliability Assessment Finite Element Simulation Methodology /

This book presents a systematic approach in performing reliability assessment of solder joints using Finite Element (FE) simulation. Essential requirements for FE modelling of an electronic package or a single reflowed solder joint subjected to reliability test conditions are elaborated. These cover...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autores principales: Tamin, Mohd N. (Autor), Shaffiar, Norhashimah M. (Autor)
Autor Corporativo: SpringerLink (Online service)
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Cham : Springer International Publishing : Imprint: Springer, 2014.
Edición:1st ed. 2014.
Colección:Advanced Structured Materials, 37
Temas:
Materials-Analysis.
Mechanics, Applied.
Solids.
Security systems.
Characterization and Analytical Technique.
Solid Mechanics.
Security Science and Technology.
Acceso en línea:Texto Completo
Tabla de Contenidos:
  • Introduction
  • Overview of the Simulation Methodology
  • Requirements for Finite Element Simulation
  • Mechanics of Solder Materials
  • Application I: Solder Joint Reflow Process
  • Application II: Solder Joints under Temperature and Mechanical Cycles
  • Damage Mechanics-based Models
  • Application III: Board-level Drop Test with BGA Package
  • Fatigue Fracture Process of Solder Joints
  • Closure.

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