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Solder Joint Reliability Assessment Finite Element Simulation Methodology /

This book presents a systematic approach in performing reliability assessment of solder joints using Finite Element (FE) simulation. Essential requirements for FE modelling of an electronic package or a single reflowed solder joint subjected to reliability test conditions are elaborated. These cover...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autores principales: Tamin, Mohd N. (Autor), Shaffiar, Norhashimah M. (Autor)
Autor Corporativo: SpringerLink (Online service)
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Cham : Springer International Publishing : Imprint: Springer, 2014.
Edición:1st ed. 2014.
Colección:Advanced Structured Materials, 37
Temas:
Acceso en línea:Texto Completo