Solder Joint Reliability Assessment Finite Element Simulation Methodology /
This book presents a systematic approach in performing reliability assessment of solder joints using Finite Element (FE) simulation. Essential requirements for FE modelling of an electronic package or a single reflowed solder joint subjected to reliability test conditions are elaborated. These cover...
Clasificación: | Libro Electrónico |
---|---|
Autores principales: | Tamin, Mohd N. (Autor), Shaffiar, Norhashimah M. (Autor) |
Autor Corporativo: | SpringerLink (Online service) |
Formato: | Electrónico eBook |
Idioma: | Inglés |
Publicado: |
Cham :
Springer International Publishing : Imprint: Springer,
2014.
|
Edición: | 1st ed. 2014. |
Colección: | Advanced Structured Materials,
37 |
Temas: | |
Acceso en línea: | Texto Completo |
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