Three-Dimensional Integration and Modeling A Revolution in RF and Wireless Packaging /

This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band tr...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autores principales: Lee, Jong-Hoon (Autor), Tentzeris, Manos M. (Autor)
Autor Corporativo: SpringerLink (Online service)
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Cham : Springer International Publishing : Imprint: Springer, 2008.
Edición:1st ed. 2008.
Colección:Synthesis Lectures on Computational Electromagnetics,
Temas:
Engineering.
Electrical engineering.
Telecommunication.
Technology and Engineering.
Electrical and Electronic Engineering.
Microwaves, RF Engineering and Optical Communications.
Acceso en línea:Texto Completo
Tabla de Contenidos:
  • Introduction
  • Background on Technologies for Millimeter-Wave Passive Front-Ends
  • Three-Dimensional Packaging in Multilayer Organic Substrates
  • Microstrip-Type Integrated Passives
  • Cavity-Type Integrated Passives
  • Three-Dimensional Antenna Architectures
  • Fully Integrated Three-Dimensional Passive Front-Ends
  • References.

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