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Three-Dimensional Integration and Modeling A Revolution in RF and Wireless Packaging /
This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band tr...
| Clasificación: | Libro Electrónico |
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| Autores principales: | , |
| Autor Corporativo: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Cham :
Springer International Publishing : Imprint: Springer,
2008.
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| Edición: | 1st ed. 2008. |
| Colección: | Synthesis Lectures on Computational Electromagnetics,
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| Temas: | |
| Acceso en línea: | Texto Completo |