Three-Dimensional Integration and Modeling A Revolution in RF and Wireless Packaging /

This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band tr...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autores principales: Lee, Jong-Hoon (Autor), Tentzeris, Manos M. (Autor)
Autor Corporativo: SpringerLink (Online service)
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Cham : Springer International Publishing : Imprint: Springer, 2008.
Edición:1st ed. 2008.
Colección:Synthesis Lectures on Computational Electromagnetics,
Temas:
Engineering.
Electrical engineering.
Telecommunication.
Technology and Engineering.
Electrical and Electronic Engineering.
Microwaves, RF Engineering and Optical Communications.
Acceso en línea:Texto Completo

MARC

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245 1 0 |a Three-Dimensional Integration and Modeling  |h [electronic resource] :  |b A Revolution in RF and Wireless Packaging /  |c by Jong-Hoon Lee, Manos M. Tentzeris. 
250 |a 1st ed. 2008. 
264 1 |a Cham :  |b Springer International Publishing :  |b Imprint: Springer,  |c 2008. 
300 |a X, 108 p.  |b online resource. 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
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490 1 |a Synthesis Lectures on Computational Electromagnetics,  |x 1932-1716 
505 0 |a Introduction -- Background on Technologies for Millimeter-Wave Passive Front-Ends -- Three-Dimensional Packaging in Multilayer Organic Substrates -- Microstrip-Type Integrated Passives -- Cavity-Type Integrated Passives -- Three-Dimensional Antenna Architectures -- Fully Integrated Three-Dimensional Passive Front-Ends -- References. 
520 |a This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization. Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules. Table of Contents: Introduction / Background on Technologies for Millimeter-Wave Passive Front-Ends / Three-Dimensional Packaging in Multilayer Organic Substrates / Microstrip-Type Integrated Passives / Cavity-Type Integrated Passives / Three-Dimensional Antenna Architectures / Fully Integrated Three-Dimensional Passive Front-Ends / References. 
650 0 |a Engineering. 
650 0 |a Electrical engineering. 
650 0 |a Telecommunication. 
650 1 4 |a Technology and Engineering. 
650 2 4 |a Electrical and Electronic Engineering. 
650 2 4 |a Microwaves, RF Engineering and Optical Communications. 
700 1 |a Tentzeris, Manos M.  |e author.  |4 aut  |4 http://id.loc.gov/vocabulary/relators/aut 
710 2 |a SpringerLink (Online service) 
773 0 |t Springer Nature eBook 
776 0 8 |i Printed edition:  |z 9783031005756 
776 0 8 |i Printed edition:  |z 9783031028311 
830 0 |a Synthesis Lectures on Computational Electromagnetics,  |x 1932-1716 
856 4 0 |u https://doi.uam.elogim.com/10.1007/978-3-031-01703-2  |z Texto Completo 
912 |a ZDB-2-SXSC 
950 |a Synthesis Collection of Technology (R0) (SpringerNature-85007) 

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