Cargando…
Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability /
This unique book provides an up-to-date overview of the fundamental concepts behind lead-free solder and interconnection technology. Readers will find a description of the rapidly increasing presence of electronic systems in all aspects of modern life as well as the increasing need for predictable r...
| Clasificación: | Libro Electrónico |
|---|---|
| Autores principales: | , , , |
| Autor Corporativo: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
New York, NY :
Springer US : Imprint: Springer,
2015.
|
| Edición: | 1st ed. 2015. |
| Temas: | |
| Acceso en línea: | Texto Completo |
Tabla de Contenidos:
- Introduction
- Interconnection : The Joint
- Phase Equilibria and Microstructure of Sn-Ag-Cu Alloys
- Microstructure Development; Solidification and Isothermal Aging
- Thermal Cycling Performance
- Mechanical Stability and Performance
- Chemical and Environment Attack
- Challenges in Future Generation Interconnects: Microstructure Again.