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Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability /

This unique book provides an up-to-date overview of the fundamental concepts behind lead-free solder and interconnection technology. Readers will find a description of the rapidly increasing presence of electronic systems in all aspects of modern life as well as the increasing need for predictable r...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autores principales: Lee, Tae-Kyu (Autor), Bieler, Thomas R. (Autor), Kim, Choong-Un (Autor), Ma, Hongtao (Autor)
Autor Corporativo: SpringerLink (Online service)
Formato: Electrónico eBook
Idioma:Inglés
Publicado: New York, NY : Springer US : Imprint: Springer, 2015.
Edición:1st ed. 2015.
Temas:
Acceso en línea:Texto Completo