Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability /
This unique book provides an up-to-date overview of the fundamental concepts behind lead-free solder and interconnection technology. Readers will find a description of the rapidly increasing presence of electronic systems in all aspects of modern life as well as the increasing need for predictable r...
Clasificación: | Libro Electrónico |
---|---|
Autores principales: | Lee, Tae-Kyu (Autor), Bieler, Thomas R. (Autor), Kim, Choong-Un (Autor), Ma, Hongtao (Autor) |
Autor Corporativo: | SpringerLink (Online service) |
Formato: | Electrónico eBook |
Idioma: | Inglés |
Publicado: |
New York, NY :
Springer US : Imprint: Springer,
2015.
|
Edición: | 1st ed. 2015. |
Temas: | |
Acceso en línea: | Texto Completo |
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