Packaging of High Power Semiconductor Lasers

This book introduces high power semiconductor laser packaging design.  The characteristics and challenges of the design and various packaging, processing, and testing techniques are detailed by the authors.  New technologies, in particular thermal technologies, current applications, and trends in hi...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autores principales: Liu, Xingsheng (Autor), Zhao, Wei (Autor), Xiong, Lingling (Autor), Liu, Hui (Autor)
Autor Corporativo: SpringerLink (Online service)
Formato: Electrónico eBook
Idioma:Inglés
Publicado: New York, NY : Springer New York : Imprint: Springer, 2015.
Edición:1st ed. 2015.
Colección:Micro- and Opto-Electronic Materials, Structures, and Systems,
Temas:
Electric power production.
Electrical Power Engineering.
Mechanical Power Engineering.
Acceso en línea:Texto Completo

MARC

LEADER 00000nam a22000005i 4500
001 978-1-4614-9263-4
003 DE-He213
005 20220115215932.0
007 cr nn 008mamaa
008 140714s2015 xxu| s |||| 0|eng d
020 |a 9781461492634  |9 978-1-4614-9263-4 
024 7 |a 10.1007/978-1-4614-9263-4  |2 doi 
050 4 |a TK1001-1841 
072 7 |a THR  |2 bicssc 
072 7 |a TEC031000  |2 bisacsh 
072 7 |a THR  |2 thema 
082 0 4 |a 621.31  |2 23 
100 1 |a Liu, Xingsheng.  |e author.  |4 aut  |4 http://id.loc.gov/vocabulary/relators/aut 
245 1 0 |a Packaging of High Power Semiconductor Lasers  |h [electronic resource] /  |c by Xingsheng Liu, Wei Zhao, Lingling Xiong, Hui Liu. 
250 |a 1st ed. 2015. 
264 1 |a New York, NY :  |b Springer New York :  |b Imprint: Springer,  |c 2015. 
300 |a XV, 402 p. 497 illus., 386 illus. in color.  |b online resource. 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
347 |a text file  |b PDF  |2 rda 
490 1 |a Micro- and Opto-Electronic Materials, Structures, and Systems,  |x 2626-238X 
505 0 |a Introduction of High Power Semiconductor Lasers -- Overview of High Power Semiconductor Laser Packages -- Thermal Design and Management in High Power Semiconductor Laser Packaging -- Thermal Stress in High Power Semiconductor Lasers -- Optical Design and Beam Shaping in High Power Semiconductor Lasers -- Materials and Components in High Power Semiconductor Laser Packaging -- Packaging Process of High Power Semiconductor Lasers -- Testing and Characterization of High Power Semiconductor Lasers -- Failure Analysis and Reliability Assessment in High Power Semiconductor Laser Packaging -- Applications of High Power Semiconductor Lasers -- Development Trend and Challenges in High Power Semiconductor Laser Packaging. 
520 |a This book introduces high power semiconductor laser packaging design.  The characteristics and challenges of the design and various packaging, processing, and testing techniques are detailed by the authors.  New technologies, in particular thermal technologies, current applications, and trends in high power semiconductor laser packaging are described at length and assessed. 
650 0 |a Electric power production. 
650 1 4 |a Electrical Power Engineering. 
650 2 4 |a Mechanical Power Engineering. 
700 1 |a Zhao, Wei.  |e author.  |4 aut  |4 http://id.loc.gov/vocabulary/relators/aut 
700 1 |a Xiong, Lingling.  |e author.  |4 aut  |4 http://id.loc.gov/vocabulary/relators/aut 
700 1 |a Liu, Hui.  |e author.  |4 aut  |4 http://id.loc.gov/vocabulary/relators/aut 
710 2 |a SpringerLink (Online service) 
773 0 |t Springer Nature eBook 
776 0 8 |i Printed edition:  |z 9781461492627 
776 0 8 |i Printed edition:  |z 9781461492641 
776 0 8 |i Printed edition:  |z 9781493955909 
830 0 |a Micro- and Opto-Electronic Materials, Structures, and Systems,  |x 2626-238X 
856 4 0 |u https://doi.uam.elogim.com/10.1007/978-1-4614-9263-4  |z Texto Completo 
912 |a ZDB-2-ENE 
912 |a ZDB-2-SXEN 
950 |a Energy (SpringerNature-40367) 
950 |a Energy (R0) (SpringerNature-43717) 

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