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Packaging of High Power Semiconductor Lasers

This book introduces high power semiconductor laser packaging design.  The characteristics and challenges of the design and various packaging, processing, and testing techniques are detailed by the authors.  New technologies, in particular thermal technologies, current applications, and trends in hi...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autores principales: Liu, Xingsheng (Autor), Zhao, Wei (Autor), Xiong, Lingling (Autor), Liu, Hui (Autor)
Autor Corporativo: SpringerLink (Online service)
Formato: Electrónico eBook
Idioma:Inglés
Publicado: New York, NY : Springer New York : Imprint: Springer, 2015.
Edición:1st ed. 2015.
Colección:Micro- and Opto-Electronic Materials, Structures, and Systems,
Temas:
Acceso en línea:Texto Completo
Descripción
Sumario:This book introduces high power semiconductor laser packaging design.  The characteristics and challenges of the design and various packaging, processing, and testing techniques are detailed by the authors.  New technologies, in particular thermal technologies, current applications, and trends in high power semiconductor laser packaging are described at length and assessed.
Descripción Física:XV, 402 p. 497 illus., 386 illus. in color. online resource.
ISBN:9781461492634
ISSN:2626-238X