Power Electronic Packaging Design, Assembly Process, Reliability and Modeling /

Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, a...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor principal: Liu, Yong (Autor)
Autor Corporativo: SpringerLink (Online service)
Formato: Electrónico eBook
Idioma:Inglés
Publicado: New York, NY : Springer New York : Imprint: Springer, 2012.
Edición:1st ed. 2012.
Temas:
Electric power production.
Electronics.
Condensed matter.
Spectrum analysis.
Electronic circuits.
Electrical Power Engineering.
Electronics and Microelectronics, Instrumentation.
Condensed Matter Physics.
Spectroscopy.
Electronic Circuits and Systems.
Acceso en línea:Texto Completo
Tabla de Contenidos:
  • Challenges of Power Electronic Packaging
  • Power Package Electrical Isolation Design
  • Discrete Power MOSFET Package Design and Analysis
  • Power IC Packaging Design and Analysis
  • Power Module/SIP/3D/Stack/Embedded Packaging Design and Considerations
  • Thermal Management, Design and Cooling for Power Electronics
  • Material Characterization for Power Electronics Packaging
  • Power Package Typical Assembly Process
  • Power Packaging Typical Reliability and Tests
  • Power Packaging Modeling and Challenges
  • Power Package Thermal and Mechanical Co-Design Simulation Automation
  • Power Package Electrical and Multiple Physics Simulation.  .

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