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Power Electronic Packaging Design, Assembly Process, Reliability and Modeling /

Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, a...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor principal: Liu, Yong (Autor)
Autor Corporativo: SpringerLink (Online service)
Formato: Electrónico eBook
Idioma:Inglés
Publicado: New York, NY : Springer New York : Imprint: Springer, 2012.
Edición:1st ed. 2012.
Temas:
Acceso en línea:Texto Completo