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Design for High Performance, Low Power, and Reliable 3D Integrated Circuits

This book describes the design of through-silicon-via (TSV) based three-dimensional integrated circuits.  It includes details of numerous "manufacturing-ready" GDSII-level layouts of TSV-based 3D ICs, developed with tools covered in the book. Readers will benefit from the sign-off level an...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor principal: Lim, Sung Kyu (Autor)
Autor Corporativo: SpringerLink (Online service)
Formato: Electrónico eBook
Idioma:Inglés
Publicado: New York, NY : Springer New York : Imprint: Springer, 2013.
Edición:1st ed. 2013.
Temas:
Acceso en línea:Texto Completo