Advanced Materials for Thermal Management of Electronic Packaging

The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry's ability to provide continued improvements in device and system performance. With increased performance requirements for smalle...

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Bibliographic Details
Call Number:Libro Electrónico
Main Author: Tong, Xingcun Colin (Author)
Corporate Author: SpringerLink (Online service)
Format: Electronic eBook
Language:Inglés
Published: New York, NY : Springer New York : Imprint: Springer, 2011.
Edition:1st ed. 2011.
Series:Springer Series in Advanced Microelectronics, 30
Subjects:
Electronic circuits.
Optical materials.
Thermodynamics.
Heat engineering.
Heat transfer.
Mass transfer.
Electronics.
Electronic Circuits and Systems.
Optical Materials.
Engineering Thermodynamics, Heat and Mass Transfer.
Electronics and Microelectronics, Instrumentation.
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