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Reliability of Microtechnology Interconnects, Devices and Systems /

Reliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. The book's focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general fail...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autores principales: Liu, Johan (Autor), Salmela, Olli (Autor), Sarkka, Jussi (Autor), Morris, James E. (Autor), Tegehall, Per-Erik (Autor), Andersson, Cristina (Autor)
Autor Corporativo: SpringerLink (Online service)
Formato: Electrónico eBook
Idioma:Inglés
Publicado: New York, NY : Springer New York : Imprint: Springer, 2011.
Edición:1st ed. 2011.
Temas:
Acceso en línea:Texto Completo

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245 1 0 |a Reliability of Microtechnology  |h [electronic resource] :  |b Interconnects, Devices and Systems /  |c by Johan Liu, Olli Salmela, Jussi Sarkka, James E. Morris, Per-Erik Tegehall, Cristina Andersson. 
250 |a 1st ed. 2011. 
264 1 |a New York, NY :  |b Springer New York :  |b Imprint: Springer,  |c 2011. 
300 |a XIII, 204 p.  |b online resource. 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
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505 0 |a Introduction to Reliability and its Importance -- Reliability Metrology -- General Failure Mechanisms of Microsystems -- Solder and Conductive Adhesive Joint Reliability -- Accelerated Testing -- Reliability Design for Manufacturability -- Component Reliability -- System Level Reliability -- Reliability and Quality Management of Microsystem -- Experimental Tools for Reliability Analysis. 
520 |a Reliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. The book's focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general failure mechanisms. Specific failure modes in solder and conductive adhesives are discussed at great length. Coverage of accelerated testing, component and system level reliability, and reliability design for manufacturability are also described in detail. The book also: Discusses the general failure mechanisms of microsystems on a component level Offers comprehensive coverage of solder joint reliability at the microsystems level Analyzes�quality issues and manufacturing at the microsystems level Reliability of Microtechnology is an ideal volume for researchers and professional engineers working in reliability and manufacturing. The book also includes exercises and detailed solutions at the end of each chapter. 
650 0 |a Electronics. 
650 0 |a Optical materials. 
650 0 |a Security systems. 
650 0 |a Microtechnology. 
650 0 |a Microelectromechanical systems. 
650 1 4 |a Electronics and Microelectronics, Instrumentation. 
650 2 4 |a Optical Materials. 
650 2 4 |a Security Science and Technology. 
650 2 4 |a Microsystems and MEMS. 
700 1 |a Salmela, Olli.  |e author.  |4 aut  |4 http://id.loc.gov/vocabulary/relators/aut 
700 1 |a Sarkka, Jussi.  |e author.  |4 aut  |4 http://id.loc.gov/vocabulary/relators/aut 
700 1 |a Morris, James E.  |e author.  |4 aut  |4 http://id.loc.gov/vocabulary/relators/aut 
700 1 |a Tegehall, Per-Erik.  |e author.  |4 aut  |4 http://id.loc.gov/vocabulary/relators/aut 
700 1 |a Andersson, Cristina.  |e author.  |4 aut  |4 http://id.loc.gov/vocabulary/relators/aut 
710 2 |a SpringerLink (Online service) 
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