Three Dimensional System Integration IC Stacking Process and Design /

Three Dimensional System Integration: IC Stacking From Process Technology to System Design Edited by: Antonis Papanikolaou Dimitrios Soudris Riko Radojcic Three-dimensional (3D) integrated circuit (IC) stacking enables packing more functionality, as well as integration of heterogeneous materials, de...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor Corporativo: SpringerLink (Online service)
Otros Autores: Papanikolaou, Antonis (Editor ), Soudris, Dimitrios (Editor ), Radojcic, Riko (Editor )
Formato: Electrónico eBook
Idioma:Inglés
Publicado: New York, NY : Springer US : Imprint: Springer, 2011.
Edición:1st ed. 2011.
Temas:
Buildings-Design and construction.
Electronic circuits.
Building Construction and Design.
Electronic Circuits and Systems.
Acceso en línea:Texto Completo
Tabla de Contenidos:
  • The next step in system integration: the benefits of going 3-D
  • Process technology for manufacturing Through-Silicon Vias (TSVs)
  • Alternative 3D integration schemes
  • Manufacturing issues in 3D stacked ICs
  • TSV characterization
  • Physical design of 3D stacked ICs
  • DRAM on logic stacking
  • 3D general purpose micro-processors
  • 3D system design: a holistic design approach.

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