Three Dimensional System Integration IC Stacking Process and Design /

Three Dimensional System Integration: IC Stacking From Process Technology to System Design Edited by: Antonis Papanikolaou Dimitrios Soudris Riko Radojcic Three-dimensional (3D) integrated circuit (IC) stacking enables packing more functionality, as well as integration of heterogeneous materials, de...

Descripción completa

Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor Corporativo: SpringerLink (Online service)
Otros Autores: Papanikolaou, Antonis (Editor ), Soudris, Dimitrios (Editor ), Radojcic, Riko (Editor )
Formato: Electrónico eBook
Idioma:Inglés
Publicado: New York, NY : Springer US : Imprint: Springer, 2011.
Edición:1st ed. 2011.
Temas:
Buildings-Design and construction.
Electronic circuits.
Building Construction and Design.
Electronic Circuits and Systems.
Acceso en línea:Texto Completo

Internet

Texto Completo

Items no disponibles

Detalle de Existencias desde

Ejemplares similares