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Three Dimensional System Integration IC Stacking Process and Design /
Three Dimensional System Integration: IC Stacking From Process Technology to System Design Edited by: Antonis Papanikolaou Dimitrios Soudris Riko Radojcic Three-dimensional (3D) integrated circuit (IC) stacking enables packing more functionality, as well as integration of heterogeneous materials, de...
| Clasificación: | Libro Electrónico |
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| Autor Corporativo: | |
| Otros Autores: | , , |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
New York, NY :
Springer US : Imprint: Springer,
2011.
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| Edición: | 1st ed. 2011. |
| Temas: | |
| Acceso en línea: | Texto Completo |