Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications
Advanced Nanoscale ULSI Interconnects: Fundamental and Applications brings a comprehensive description of copper based interconnect technology for Ultra Large Scale Integration (ULSI) technology to Integrated Circuit (ICs) application. This book reviews the basic technologies used today for the copp...
Clasificación: | Libro Electrónico |
---|---|
Autor Corporativo: | SpringerLink (Online service) |
Otros Autores: | Shacham-Diamand, Yosi (Editor ), Osaka, Tetsuya (Editor ), Datta, Madhav (Editor ), Ohba, Takayuki (Editor ) |
Formato: | Electrónico eBook |
Idioma: | Inglés |
Publicado: |
New York, NY :
Springer New York : Imprint: Springer,
2009.
|
Edición: | 1st ed. 2009. |
Temas: | |
Acceso en línea: | Texto Completo |
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