Micromachined Thin-Film Sensors for SOI-CMOS Co-Integration
Co-integration of sensors with their associated electronics on a single silicon chip may provide many significant benefits regarding performance, reliability, miniaturization and process simplicity without significantly increasing the total cost. Micromachined Thin-Film Sensors for SOI-CMOS Co-integ...
Clasificación: | Libro Electrónico |
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Autores principales: | Laconte, Jean (Autor), Flandre, Denis (Autor), Raskin, Jean-Pierre (Autor) |
Autor Corporativo: | SpringerLink (Online service) |
Formato: | Electrónico eBook |
Idioma: | Inglés |
Publicado: |
New York, NY :
Springer US : Imprint: Springer,
2006.
|
Edición: | 1st ed. 2006. |
Temas: | |
Acceso en línea: | Texto Completo |
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