Micromachined Thin-Film Sensors for SOI-CMOS Co-Integration

Co-integration of sensors with their associated electronics on a single silicon chip may provide many significant benefits regarding performance, reliability, miniaturization and process simplicity without significantly increasing the total cost. Micromachined Thin-Film Sensors for SOI-CMOS Co-integ...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autores principales: Laconte, Jean (Autor), Flandre, Denis (Autor), Raskin, Jean-Pierre (Autor)
Autor Corporativo: SpringerLink (Online service)
Formato: Electrónico eBook
Idioma:Inglés
Publicado: New York, NY : Springer US : Imprint: Springer, 2006.
Edición:1st ed. 2006.
Temas:
Engineering.
Mechanics.
Industrial engineering.
Production engineering.
Electronics.
Electronic circuits.
Condensed matter.
Technology and Engineering.
Classical Mechanics.
Industrial and Production Engineering.
Electronics and Microelectronics, Instrumentation.
Electronic Circuits and Systems.
Condensed Matter Physics.
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