Cargando…
Micromachined Thin-Film Sensors for SOI-CMOS Co-Integration
Co-integration of sensors with their associated electronics on a single silicon chip may provide many significant benefits regarding performance, reliability, miniaturization and process simplicity without significantly increasing the total cost. Micromachined Thin-Film Sensors for SOI-CMOS Co-integ...
| Clasificación: | Libro Electrónico |
|---|---|
| Autores principales: | , , |
| Autor Corporativo: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
New York, NY :
Springer US : Imprint: Springer,
2006.
|
| Edición: | 1st ed. 2006. |
| Temas: | |
| Acceso en línea: | Texto Completo |
MARC
| LEADER | 00000nam a22000005i 4500 | ||
|---|---|---|---|
| 001 | 978-0-387-28843-7 | ||
| 003 | DE-He213 | ||
| 005 | 20220119130319.0 | ||
| 007 | cr nn 008mamaa | ||
| 008 | 100301s2006 xxu| s |||| 0|eng d | ||
| 020 | |a 9780387288437 |9 978-0-387-28843-7 | ||
| 024 | 7 | |a 10.1007/0-387-28843-0 |2 doi | |
| 050 | 4 | |a T1-995 | |
| 072 | 7 | |a TBC |2 bicssc | |
| 072 | 7 | |a TEC000000 |2 bisacsh | |
| 072 | 7 | |a TBC |2 thema | |
| 082 | 0 | 4 | |a 620 |2 23 |
| 100 | 1 | |a Laconte, Jean. |e author. |4 aut |4 http://id.loc.gov/vocabulary/relators/aut | |
| 245 | 1 | 0 | |a Micromachined Thin-Film Sensors for SOI-CMOS Co-Integration |h [electronic resource] / |c by Jean Laconte, Denis Flandre, Jean-Pierre Raskin. |
| 250 | |a 1st ed. 2006. | ||
| 264 | 1 | |a New York, NY : |b Springer US : |b Imprint: Springer, |c 2006. | |
| 300 | |a XIV, 292 p. |b online resource. | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a computer |b c |2 rdamedia | ||
| 338 | |a online resource |b cr |2 rdacarrier | ||
| 347 | |a text file |b PDF |2 rda | ||
| 505 | 0 | |a Introduction: Context and motivations -- Introduction: Context and motivations -- Techniques and materials -- Silicon bulk micromachining with TMAH -- Thin dielectric films stress extraction -- Microsensors -- Low power microhotplate as basic cell -- Microheater based flow sensor -- Gas Sensors on microhotplate -- SOI-CMOS compatibility validation -- Conclusions and outlook -- Conclusions and outlook. | |
| 520 | |a Co-integration of sensors with their associated electronics on a single silicon chip may provide many significant benefits regarding performance, reliability, miniaturization and process simplicity without significantly increasing the total cost. Micromachined Thin-Film Sensors for SOI-CMOS Co-integration covers the challenges and interests and demonstrates the successful co-integration of gas-flow sensors on dielectric membrane, with their associated electronics, in CMOS-SOI technology. We firstly investigate the extraction of residual stress in thin layers and in their stacking and the release, in post-processing, of a 1 µm-thick robust and flat dielectric multilayered membrane using Tetramethyl Ammonium Hydroxide (TMAH) silicon micromachining solution. The optimization of its selectivity towards aluminum is largely demonstrated. The second part focuses on sensors design and characteristics. A novel loop-shape polysilicon microheater is designed and built in a CMOS-SOI standard process. High thermal uniformity, low power consumption and high working temperature are confirmed by extensive measurements. The additional gas flow sensing layers are judiciously chosen and implemented. Measurements in the presence of a nitrogen flow and gas reveal fair sensitivity on a large flow velocity range as well as good response to many gases. Finally, MOS transistors suspended on released dielectric membranes are presented and fully characterized as a concluding demonstrator of the co-integration in SOI technology. | ||
| 650 | 0 | |a Engineering. | |
| 650 | 0 | |a Mechanics. | |
| 650 | 0 | |a Industrial engineering. | |
| 650 | 0 | |a Production engineering. | |
| 650 | 0 | |a Electronics. | |
| 650 | 0 | |a Electronic circuits. | |
| 650 | 0 | |a Condensed matter. | |
| 650 | 1 | 4 | |a Technology and Engineering. |
| 650 | 2 | 4 | |a Classical Mechanics. |
| 650 | 2 | 4 | |a Industrial and Production Engineering. |
| 650 | 2 | 4 | |a Electronics and Microelectronics, Instrumentation. |
| 650 | 2 | 4 | |a Electronic Circuits and Systems. |
| 650 | 2 | 4 | |a Condensed Matter Physics. |
| 700 | 1 | |a Flandre, Denis. |e author. |4 aut |4 http://id.loc.gov/vocabulary/relators/aut | |
| 700 | 1 | |a Raskin, Jean-Pierre. |e author. |4 aut |4 http://id.loc.gov/vocabulary/relators/aut | |
| 710 | 2 | |a SpringerLink (Online service) | |
| 773 | 0 | |t Springer Nature eBook | |
| 776 | 0 | 8 | |i Printed edition: |z 9781441939579 |
| 776 | 0 | 8 | |i Printed edition: |z 9780387509556 |
| 776 | 0 | 8 | |i Printed edition: |z 9780387288420 |
| 856 | 4 | 0 | |u https://doi.uam.elogim.com/10.1007/0-387-28843-0 |z Texto Completo |
| 912 | |a ZDB-2-ENG | ||
| 912 | |a ZDB-2-SXE | ||
| 950 | |a Engineering (SpringerNature-11647) | ||
| 950 | |a Engineering (R0) (SpringerNature-43712) | ||