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Reliability and failure analysis of high-power led packaging.

Reliability and Failure Analysis of High-Power LED Packaging provides fundamental understanding of the reliability and failure analysis of materials for high-power LED packaging, with the ultimate goal of enabling new packaging materials. This book describes the limitations of the present reliabilit...

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Détails bibliographiques
Cote:Libro Electrónico
Auteur principal: Tan, Cher Ming
Autres auteurs: Singh, Preetpal
Format: Électronique eBook
Langue:Inglés
Publié: Cambridge, MA : Woodhead Publishing Limited, 2022.
Collection:Woodhead Publishing series in electronic and optical materials
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Accès en ligne:Texto completo

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