Reliability and failure analysis of high-power led packaging.

Reliability and Failure Analysis of High-Power LED Packaging provides fundamental understanding of the reliability and failure analysis of materials for high-power LED packaging, with the ultimate goal of enabling new packaging materials. This book describes the limitations of the present reliabilit...

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Bibliographic Details
Call Number:Libro Electrónico
Main Author: Tan, Cher Ming
Other Authors: Singh, Preetpal
Format: Electronic eBook
Language:Inglés
Published: Cambridge, MA : Woodhead Publishing Limited, 2022.
Series:Woodhead Publishing series in electronic and optical materials
Subjects:
Reliability (Engineering)
Failure analysis (Engineering)
Light emitting diodes > Reliability.
Packaging.
Fiabilit�e.
Analyse des d�efaillances (Ing�enierie)
Diodes �electroluminescentes > Fiabilit�e.
Conditionnement (Emballage)
packaging.
Light emitting diodes > Reliability
Packaging
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